Inventor

ARITA KAZUO

JP26 patents

⚠️ This page may combine multiple inventors who share the name “ARITA KAZUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ARITA KAZUO

DAINIPPON INK & CHEMICALS

Epoxy compound, composition, cured product and laminate

Active ester resin, epoxy resin composition, cured product thereof, prepreg, circuit board, and build-up film

Epoxy resin, method for producing epoxy resin, epoxy resin composition, cured product thereof, and heat-dissipating resin material

Epoxy resin composition,cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin,method for producing novel phenol resin, and method for producing novel epoxy resin

Composition, cured product and laminate

Substituted or unsubstituted allyl group-containing maleimide compound, production method therefor, and composition and cured product using said compound

Oxazine compound, composition and cured product

Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin

Resin composition, cured product, laminate, and electronic member

Oxazine compound, composition and cured product

Oxazine compound, composition, and cured product

Oxazine compound, composition and cured product

Oxazine compound, composition and cured product

Active ester resin, thermosetting resin composition, cured product of same, semiconductor encapsulation material, prepreg, circuit board, and build-up film

Preparing epoxy resin by distilling two fractions to recover and reuse epihalohydrin without glycidol

Methods for producing polycyclic aromatic aminophenol compound and resin composition, and polycyclic aromatic aminophenol compound, resin composition, and cured product

Active ester resin containing phosphorus atom, epoxy resin composition and cured product thereof, prepreg, circuit board, and build-up film

Curable resin composition, cured product thereof, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, build-up film, build-up substrate, fiber-reinforced composite material, and fiber-reinforced resin molded product

SATOU YUTAKA

Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the same

Phenol resin composition, production method therefor, curable resin composition, cured product thereof, and printed circuit board

ARITA KAZUO

Thermosetting resin composition, cured product thereof, active ester resin, semiconductor encapsulating material, prepreg, circuit board, and build-up film

Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol resin and semiconductor-encapsulating material

NISSAN MOTOR

Constant velocity universal joint

OGURA ICHIROU

Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin

OGURA ICHIRO

Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resin

TAKEUCHI KAN

Active ester resin, method for producing the same, thermosetting resin composition, cured product of the thermosetting resin composition, semiconductor encapsulating material, pre-preg, circuit board, and build-up film