Inventor
LAO CHEN-HSIANG
TW8 patents
Patents
8 patentsUS11062971B2Jul 13, 2021
Package structure and method and equipment for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations85
US11302600B2Apr 12, 2022
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83
US11810833B2Nov 7, 2023
Package structure and method and equipment for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US12170237B2Dec 17, 2024
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12021006B2Jun 25, 2024
Package structure and method and equipment for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11715675B2Aug 1, 2023
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12412805B2Sep 9, 2025
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11996342B2May 28, 2024
Semiconductor package comprising heat dissipation plates
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60