Inventor · disambiguated record
Hermes T. Apale
Also filed as: APALE HERMES T
8 granted patents·147 citations·filing 2002–2023
87Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0184US6875634B2Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the sameST ASSEMBLY TEST SERVICES PTE·Filed 2004·Granted Apr 5, 2005·36 cites·21 claims
- 0283US6960493B2Semiconductor device packageST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Nov 1, 2005·30 cites·16 claims
- 0380US6825067B2Mold cap anchoring method for molded flex BGA packagesST ASSEMBLY TEST SERVICES PTE·Filed 2002·Granted Nov 30, 2004·26 cites·20 claims
- 0480US6737298B2Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the sameST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted May 18, 2004·31 cites·18 claims
- 0573US12211778B2Semiconductor device and method of forming bump pad array on substrate for ground connection for heat sink/shielding structureSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jan 28, 2025·0 cites·31 claims
- 0672US6706563B2Heat spreader interconnect methodology for thermally enhanced PBGA packagesST ASSEMBLY TEST SERVICES PTE·Filed 2002·Granted Mar 16, 2004·18 cites·36 claims
- 0766US11764136B2Semiconductor device and method of forming bump pad array on substrate for ground connection for heat sink/shielding structureSTATS CHIPPAC PTE LTD·Filed 2021·Granted Sep 19, 2023·0 cites·31 claims
- 0855US6818981B2Heat spreader interconnect for thermally enhanced PBGA packagesST ASSEMBLY TEST SERVICES PTE·Filed 2004·Granted Nov 16, 2004·6 cites·11 claims
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