Inventor
EISELE RONALD
DE35 patents
⚠️ This page may combine multiple inventors who share the name “EISELE RONALD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DANFOSS SILICON POWER GMBH
23 patentsUS7339788B2Mar 4, 2008
Cooling unit and flow distributing element for use in such unit
DANFOSS SILICON POWER GMBH30 citations89
US10832995B2Nov 10, 2020
Power module
DANFOSS SILICON POWER GMBH3 citations72
US10079219B2Sep 18, 2018
Power semiconductor contact structure and method for the production thereof
DANFOSS SILICON POWER GMBH2 citations72
US7040381B2May 9, 2006
Cooling device
DANFOSS SILICON POWER GMBH7 citations72
US11400514B2Aug 2, 2022
Sintering tool and method for sintering an electronic subassembly
DANFOSS SILICON POWER GMBH3 citations71
US10483229B2Nov 19, 2019
Sintering device
DANFOSS SILICON POWER GMBH2 citations71
US11776932B2Oct 3, 2023
Process and device for low-temperature pressure sintering
DANFOSS SILICON POWER GMBH0 citations61
US11626383B2Apr 11, 2023
Process and device for low-temperature pressure sintering
DANFOSS SILICON POWER GMBH0 citations61
US10381283B2Aug 13, 2019
Power semiconductor module
DANFOSS SILICON POWER GMBH1 citations61
US7529091B2May 5, 2009
Power semiconductor module and method for cooling a power semiconductor module
DANFOSS SILICON POWER GMBH3 citations61
US12581983B2Mar 17, 2026
Semiconductor module comprising a semiconductor and comprising a shaped metal body that is electrically contacted by the semiconductor
DANFOSS SILICON POWER GMBH0 citations58
US12125817B2Oct 22, 2024
Semiconductor module with a first substrate, a second substrate and a spacer separating the substrates from each other
DANFOSS SILICON POWER GMBH0 citations58
US12133366B2Oct 29, 2024
Power electronics module with improved cooling
DANFOSS SILICON POWER GMBH0 citations56
US10306800B2May 28, 2019
Cooling trough, cooler and power module assembly
DANFOSS SILICON POWER GMBH1 citations56
US8017446B2Sep 13, 2011
Method for manufacturing a rigid power module suited for high-voltage applications
DANFOSS SILICON POWER GMBH2 citations56
US10814396B2Oct 27, 2020
Sintering tool and method for sintering an electronic subassembly
DANFOSS SILICON POWER GMBH0 citations51
US10818633B2Oct 27, 2020
Sintering tool for the lower die of a sintering device
DANFOSS SILICON POWER GMBH0 citations51
US10607962B2Mar 31, 2020
Method for manufacturing semiconductor chips
DANFOSS SILICON POWER GMBH0 citations51
US10438924B2Oct 8, 2019
Method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module
DANFOSS SILICON POWER GMBH0 citations51
US10403566B2Sep 3, 2019
Power module
DANFOSS SILICON POWER GMBH0 citations51
US10332858B2Jun 25, 2019
Electronic sandwich structure with two parts joined together by means of a sintering layer
DANFOSS SILICON POWER GMBH0 citations51
US9613929B2Apr 4, 2017
Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
DANFOSS SILICON POWER GMBH1 citations51
US12136585B2Nov 5, 2024
Compact power electronics module with increased cooling surface
DANFOSS SILICON POWER GMBH0 citations45
EISELE RONALD
4 patentsUS9040338B2May 26, 2015
Power semiconductor module with method for manufacturing a sintered power semiconductor module
EISELE RONALD15 citations82
US8490681B2Jul 23, 2013
Fluid cooling system
EISELE RONALD4 citations60
US8118211B2Feb 21, 2012
Method for the low-temperature pressure sintering of electronic units to heat sinks
EISELE RONALD1 citations48
US8546923B2Oct 1, 2013
Rigid power module suited for high-voltage applications
EISELE RONALD0 citations44
HERAEUS DEUTSCHLAND GMBH & CO KG
2 patentsUS10685894B2Jun 16, 2020
Semi-conductor module with an encapsulating cement mass that covers a semi-conductor component
HERAEUS DEUTSCHLAND GMBH & CO KG2 citations73
US10593608B2Mar 17, 2020
Semiconductor module comprising an encapsulating compound that covers at least one semiconductor component
HERAEUS DEUTSCHLAND GMBH & CO KG2 citations69
BECKER MARTIN
2 patentsUS9786627B2Oct 10, 2017
Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips
BECKER MARTIN1 citations50
US9318421B2Apr 19, 2016
Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
BECKER MARTIN0 citations50