Inventor

DING LIANG

CN101 patents

⚠️ This page may combine multiple inventors who share the name “DING LIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DING LIANG

NINGBO SUNNY OPOTECH CO LTD

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Adjustable optical lens and camera module and manufacturing method thereof

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

Manufacturing method of molded photosensitive assembly for electronic device

Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Camera lens module and manufacturing method thereof

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

System-level camera module with electrical support and manufacturing method thereof

Adjustable optical lens and camera module and manufacturing method thereof

Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof

Camera lens module and manufacturing method thereof

Camera lens module with one or more optical lens modules and manufacturing method thereof

Molded photosensitive assembly for array imaging module for electronic device

System-level camera module with electrical support and manufacturing method thereof

Camera lens module with one or more optical lens modules and manufacturing method thereof

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Camera lens module and manufacturing method thereof

Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device

Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device

Camera lens module and manufacturing method thereof

Adjustable optical lens and camera module, manufacturing method and applications thereof

INPHI CORP

Method for co-packaging light engine chiplets on switch substrate

Co-packaged light engine chiplets on switch substrate

Heatsink for co-packaged optical switch rack package

Light engine based on silicon photonics TSV interposer

Optical transceiver by FOWLP and DoP multichip integration

Compact optical transceiver by hybrid multichip integration

Vertical integration of hybrid waveguide with controlled interlayer thickness

Compact optical module integrated for communicating cryptocurrency transaction

Light engine based on silicon photonics TSV interposer

Optical transceiver by FOWLP and DOP multichip integration

Compact optical transceiver by hybrid multichip integration

Vertical integration of hybrid waveguide with controlled interlayer thickness

MARVELL ASIA PTE LTD

Method for co-packaging light engine chiplets on switch substrate

Heatsink for co-packaged optical switch rack package

Light engine based on silicon photonics TSV interposer

Light engine based on silicon photonics TSV interposer

In-packaged multi-channel light engine on single substrate

LI MING

Projection system and method of curved film

USHIDA JUN

Silicon-based electro-optic device

ZTE CORP

Mobile terminal and specific absorption rate reduction method

HARBIN INST TECHNOLOGY

Soft biomimetic legged robot