Inventor
STAHL HEIKO
DE22 patents
⚠️ This page may combine multiple inventors who share the name “STAHL HEIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
BOSCH GMBH ROBERT
14 patentsUS9667419B2May 30, 2017
System and method for cryptographic key identification
BOSCH GMBH ROBERT2 citations72
US9428378B2Aug 30, 2016
Component including two semiconductor elements between which at least two hermetically tightly sealed cavities having different internal pressures are formed and method for manufacturing such a component
BOSCH GMBH ROBERT3 citations68
US7740459B2Jun 22, 2010
Micropump having a pump diaphragm and a polysilicon layer
BOSCH GMBH ROBERT6 citations61
US10889491B2Jan 12, 2021
Method for producing a micromechanical element
BOSCH GMBH ROBERT0 citations57
US10336610B2Jul 2, 2019
Method for producing a micromechanical component
BOSCH GMBH ROBERT1 citations57
US12570522B2Mar 10, 2026
Method for producing at least one first and one second micromirror device
BOSCH GMBH ROBERT0 citations51
US9725300B2Aug 8, 2017
Capacitive MEMS-sensor element having bond pads for the electrical contacting of the measuring capacitor electrodes
BOSCH GMBH ROBERT1 citations51
US7863072B2Jan 4, 2011
Micromechanical diaphragm sensor having a double diaphragm
BOSCH GMBH ROBERT1 citations51
US10775253B2Sep 15, 2020
Method for producing a micromechanical component with an exposed pressure sensor device and micromechanical component
BOSCH GMBH ROBERT0 citations48
US10643896B2May 5, 2020
Method for producing at least one via in a wafer
BOSCH GMBH ROBERT0 citations48
US7436076B2Oct 14, 2008
Micromechanical component having an anodically bonded cap and a manufacturing method
BOSCH GMBH ROBERT1 citations48
US12404170B2Sep 2, 2025
Method for producing a bonding pad for a micromechanical sensor element
BOSCH GMBH ROBERT0 citations44
US9650240B2May 16, 2017
Component including two semiconductor elements, which are bonded to one another via a structured bonding layer, and method for manufacturing a component of this type
BOSCH GMBH ROBERT0 citations41
US10766778B2Sep 8, 2020
Polycrystalline material having low mechanical strain; method for producing a polycrystalline material
BOSCH GMBH ROBERT0 citations35
STAHL HEIKO
4 patentsUS8393215B2Mar 12, 2013
Micromechanical acceleration sensor having an open seismic mass
STAHL HEIKO4 citations60
US8492188B2Jul 23, 2013
Method for producing a micromechanical component
STAHL HEIKO1 citations49
US8402827B2Mar 26, 2013
Sensor element and method for operating a sensor element
STAHL HEIKO1 citations48
US9206034B2Dec 8, 2015
Micromechanical component having a bond joint
STAHL HEIKO0 citations45