Inventor

BRUNNBAUER MARKUS

DE56 patents

⚠️ This page may combine multiple inventors who share the name “BRUNNBAUER MARKUS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BRUNNBAUER MARKUS

INFINEON TECHNOLOGIES AG

Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device

Semiconductor device

Method for producing chip packages, and chip package produced in this way

Semiconductor module

Reconfigured wafer alignment

Semiconductor device including covering a semiconductor with a molding compound and forming a through hole in the molding compound

Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips

Composite board with semiconductor chips and plastic housing composition and method

Component and method for producing a component

Semiconductor device having an adhesion promoting layer and method for producing it

Producing thin integrated semiconductor devices

Semiconductor module comprising semiconductor chips and method for producing the same

Semiconductor stack block comprising semiconductor chips and methods for producing the same

Electronic structure with components connected by way of solderable connecting elements and method

Method of dicing a wafer and semiconductor chip

Encapsulation method

Carrier arrangement and method for processing a carrier by generating a crack structure

Method of separating semiconductor dies from a semiconductor substrate, semiconductor substrate assembly and semiconductor die assembly

Method for producing a device and device

Semiconductor module with a dielectric layer including a fluorocarbon compound on a chip

Stacked semiconductor chips

Integrated circuit including parylene material layer

MEYER THORSTEN

Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device

Semiconductor component including a semiconductor chip and a passive component

Semiconductor device with chip having low-k-layers

Component and method for producing a component

Article and panel comprising semiconductor chips, casting mold and methods of producing the same

Article and panel comprising semiconductor chips, casting mold and methods of producing the same

Semiconductor device

Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device

Method for producing chip packages, and chip package produced in this way

BRUNNBAUER MARKUS

Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chip

Semiconductor module having a semiconductor chip stack and method

Electronic device and method for producing a device

Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads

Structure for electrostatic discharge in embedded wafer level packages

Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same

Stacked semiconductor chips

Mold apparatus and method

Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same

BARTH HANS-JOACHIM

On-chip RF shields with front side redistribution lines

On-chip radio frequency shield with interconnect metallization

On-Chip RF shields with front side redistribution lines

POHL JENS

Stackable semiconductor package with encapsulant and electrically conductive feed-through

Semiconductor device

INTEL MOBILE COMM GMBH

Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips

Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips

ZUDOCK FRANK

Semiconductor device

BEER GOTTFRIED

Heat treatment for a panel and apparatus for carrying out the heat treatment method

INTEL DEUTSCHLAND GMBH

Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips