Inventor
HOSOKAWA KAZUHITO
JP37 patents
⚠️ This page may combine multiple inventors who share the name “HOSOKAWA KAZUHITO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NITTO DENKO CORP
28 patentsUS7262514B2Aug 28, 2007
Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device
NITTO DENKO CORP25 citations92
US7064011B2Jun 20, 2006
Semiconductor device fabricating apparatus and semiconductor device fabricating method
NITTO DENKO CORP21 citations91
US7235888B2Jun 26, 2007
Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device
NITTO DENKO CORP15 citations84
US11241863B2Feb 8, 2022
Glass roll with resin film
NITTO DENKO CORP5 citations83
US7232709B2Jun 19, 2007
Process for producing a semiconductor device
NITTO DENKO CORP14 citations83
US7132755B2Nov 7, 2006
Adhesive film for manufacturing semiconductor device
NITTO DENKO CORP11 citations83
US6211261B1Apr 3, 2001
Thermosetting pressure-sensitive adhesive and adhesive sheet thereof
NITTO DENKO CORP18 citations83
US6858473B2Feb 22, 2005
Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device
NITTO DENKO CORP12 citations80
US7772040B2Aug 10, 2010
Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
NITTO DENKO CORP6 citations74
US7115989B2Oct 3, 2006
Adhesive sheet for producing a semiconductor device
NITTO DENKO CORP10 citations74
US11198274B2Dec 14, 2021
Optical laminate having thin glass, polarizer, and protective film with specified modulus of elasticity
NITTO DENKO CORP2 citations73
US6312799B1Nov 6, 2001
Pressure-sensitive acrylic adhesive composition for adhesion of polyester film and adhesive sheets thereof
NITTO DENKO CORP9 citations73
US6130269AOct 10, 2000
Pressure-sensitive adhesive of (meth)acrylate, unsaturated acid, poly(meth)acrylate and epoxy resin
NITTO DENKO CORP12 citations73
US10859871B2Dec 8, 2020
Optical member, and polarizing plate set and liquid crystal display device that use said optical member
NITTO DENKO CORP1 citations62
US10809433B2Oct 20, 2020
Circularly polarizing plate for organic EL display device, and organic EL display device
NITTO DENKO CORP1 citations62
US6261685B1Jul 17, 2001
Thermosetting adhesive and adhesive sheet thereof
NITTO DENKO CORP6 citations62
US12311645B2May 27, 2025
Glass film-resin composite
NITTO DENKO CORP0 citations61
US11926140B2Mar 12, 2024
Glass roll with resin film
NITTO DENKO CORP0 citations61
US11738534B2Aug 29, 2023
Glass film-resin composite
NITTO DENKO CORP1 citations61
US11731412B2Aug 22, 2023
Production method for film laminate
NITTO DENKO CORP0 citations61
US10960610B2Mar 30, 2021
Production method for film laminate
NITTO DENKO CORP1 citations61
US11536877B2Dec 27, 2022
Laminated optical film, method of producing laminated optical film, optical element, and image display
NITTO DENKO CORP0 citations52
US11524481B2Dec 13, 2022
Low refractive index layer, laminated film, method for producing low refractive index layer, method for producing laminated film, optical element, and image display device
NITTO DENKO CORP0 citations52
US10678083B2Jun 9, 2020
Optical member comprising a polarizing plate and a low-refractive index layer having a porous layer
NITTO DENKO CORP0 citations52
US11999133B2Jun 4, 2024
Manufacturing method for glass film with resin tape, and manufacturing method for glass film
NITTO DENKO CORP0 citations50
US10741776B2Aug 11, 2020
Flexible light-emitting device, lighting apparatus, and image display
NITTO DENKO CORP0 citations50
US10302994B2May 28, 2019
Optical member
NITTO DENKO CORP0 citations42
US10688759B2Jun 23, 2020
Method for manufacturing optical laminate
NITTO DENKO CORP0 citations41
DAINIPPON PRINTING CO LTD
3 patentsUS7365441B2Apr 29, 2008
Semiconductor device fabricating apparatus and semiconductor device fabricating method
DAINIPPON PRINTING CO LTD15 citations82
US8018044B2Sep 13, 2011
Semiconductor device, substrate for producing semiconductor device and method of producing them
DAINIPPON PRINTING CO LTD3 citations61
US7943427B2May 17, 2011
Semiconductor device, substrate for producing semiconductor device and method of producing them
DAINIPPON PRINTING CO LTD0 citations40
MISUMI SADAHITO
2 patentsUS8278153B2Oct 2, 2012
Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
MISUMI SADAHITO4 citations61
US8975759B2Mar 10, 2015
Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
MISUMI SADAHITO0 citations51