Inventor

WU CHIH-WEI

TW121 patents

⚠️ This page may combine multiple inventors who share the name “WU CHIH-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WU CHIH-WEI

TAIWAN SEMICONDUCTOR MFG CO LTD

Package structures and methods of forming the same

Integrated circuit package and method of forming same

Package structures and methods of forming the same

Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure

Semiconductor structure having a dielectric layer edge covering circuit carrier

Package and method of manufacturing the same

Dummy die placement without backside chipping

Package structure including a first die and a second die and a bridge die and method of forming the package structure

Package of integrated circuits having a light-to-heat-conversion coating material

Integrated circuit package and method of forming same

Semiconductor package and manufacturing method thereof

Three dimensional integrated circuit (3DIC) with support structures

Method of manufacturing a release film as isolation film in package

Die-on-interposer assembly with dam structure and method of manufacturing the same

Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure

Chip packages and methods of manufacture thereof

Semiconductor package and manufacturing method thereof

Package component, electronic device and manufacturing method thereof

Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structure

Semiconductor package and manufacturing method thereof

Package structure having bridge structure for connection between semiconductor dies

Semiconductor package and manufacturing method thereof

Integrated circuit package and method of forming same

Semiconductor package and manufacturing method thereof

Dummy die placement without backside chipping

Joint structure in semiconductor package and manufacturing method thereof

Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same

Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same

Package structure and method of manufacturing the same

Package structure having bridge structure for connection between semiconductor dies and method of fabricating the same

Integrated fan-out packages and methods of forming the same

PoP device and method of forming the same

Apparatus for dicing interposer assembly

Semiconductor packages and manufacturing method thereof

Chip package structure

TAIWAN SEMICONDUCTOR MFG

Die-on-interposer assembly with dam structure and method of manufacturing the same

Apparatus and methods for molding die on wafer interposers

Three-dimensional integrated circuit (3DIC)

WANG CHUNG YU

Apparatus and methods for molding die on wafer interposers

Apparatus and methods for dicing interposer assembly

WU CHIH-WEI

Assembly method for three dimensional integrated circuit

Three-dimensional integrated circuit (3DIC) formation process

DOLBY LABORATORIES LICENSING CORP

Perceptually-based loss functions for audio encoding and decoding based on machine learning

Blind bandwidth extension using K-means and a support vector machine

BENQ CORP

Cellular phone structure and portable electronic apparatus

Mouse

DFI INC

Desktop personal computer and thermal module thereof

QISDA CORP

Foldable computer mouse

EPISTAR CORP

Light-emitting element having a plurality of light-emitting structures

CHENG HUNG-HSIANG

Semiconductor device having shielded conductive vias