Inventor

LU CHUN-LIN

TW81 patents

⚠️ This page may combine multiple inventors who share the name “LU CHUN-LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LU CHUN-LIN

TAIWAN SEMICONDUCTOR MFG CO LTD

Method for forming package-on-package structure

Package, package structure with redistributing circuits and antenna elements and method of manufacturing the same

Electronic device and manufacturing method thereof

Package structure with reinforcement structures in a redistribution circuit structure and method of manufacturing the same

Semiconductor structure and manufacturing method thereof

Packaged semiconductor devices and packaging methods

Semiconductor device and manufacturing method thereof

Methods and apparatus for package with interposers

Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface

Semiconductor device having a guard ring

Methods and apparatus for package with interposers

Package structure and method of manufacturing the same

Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof

Package structure and fabricating method thereof

Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof

Package structure and method of manufacturing the same

Packaged semiconductor devices and packaging methods

Methods and apparatus for package with interposers

Surface mounting semiconductor components

Semiconductor package structure

Semiconductor structure and manufacturing method thereof

Manufacturing method of semiconductor structure

Methods and apparatus for package with interposers

Packaged semiconductor devices and packaging methods

Semiconductor device

Semiconductor package structure

Package structure having connecting module

Integrated fan-out package

Method of packaging semiconductor devices

Semiconductor structure and manufacturing method thereof

Mechanisms for forming hybrid bonding structures with elongated bumps

Package, package structure and method of manufacturing the same

Package structure and method of manufacturing the same

Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof

Manufacturing method of a semiconductor device

Methods of manufacturing a semiconductor device including a joint adjacent to a post

Semiconductor structure and manufacturing method thereof

Integrated fan-out package and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Package structure and manufacturing method thereof

Integrated fan-out package and manufacturing method thereof

Semiconductor device

Semiconductor structure and manufacturing method thereof

Interconnection structure including a metal post encapsulated by a joint material having concave outer surface

TAIWAN SEMICONDUCTOR MFG

Methods and apparatus for package with interposers

Semiconductor devices and methods of manufacture thereof

Semiconductor structure and manufacturing method thereof

UNIV NAT TAIWAN SCIENCE TECH

Color temperature tunable white light emitting device

TAIWAN SEMIDONDUCTOR MFG COMPANY LTD

Methods and apparatus for package with interposers

POWERCHIP SEMICONDUCTOR MFG CORP

Through-substrate via test structure