Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof

Abstract

A package structure includes an insulating encapsulation, at least one semiconductor die, a redistribution circuit structure, and first reinforcement structures. The at least one semiconductor die is encapsulated in the insulating encapsulation. The redistribution circuit structure is located on the insulating encapsulation and electrically connected to the at least one semiconductor die. The first reinforcement structures are embedded in the redistribution circuit structure. A shape of the package structure includes a polygonal shape on a vertical projection along a stacking direction of the insulating encapsulation and the redistribution circuit structure, and the first reinforcement structures are located on and extended along diagonal lines of the package structure.

What is claimed is: 
     
       1. A package structure, comprising:
 a first redistribution structure and a second redistribution structure; 
 a die, disposed between and electrically coupled to the first redistribution structure and the second redistribution structure; 
 an insulating encapsulation, disposed between the first redistribution structure and the second redistribution structure and encapsulating the die; 
 a first reinforcement structure, embedded in one of the first redistribution structure and the second redistribution structure and overlapped with the die and the insulating encapsulation in a vertical projection; and 
 a first connecting structure, embedded in one of the first redistribution structure and the second redistribution structure and overlapped with the insulating encapsulation and offset from the die in the vertical projection, 
 wherein a width of the first reinforcement structure is greater than the a width of the first connecting structure. 
 
     
     
       2. The package structure of  claim 1 , wherein the first reinforcement structure comprises:
 a first structure extends along a portion of an edge of the die; 
 a second structure extends outward from a corner of the die; or 
 a first structure extends along a portion of an edge of the die and a second structure extends outward from a corner of the die. 
 
     
     
       3. The package structure of  claim 1 , further comprising:
 a second reinforcement structure, embedded in other one of the first redistribution structure and the second redistribution structure and overlapped with the die and the insulating encapsulation in a vertical projection; and 
 a second connecting structure, embedded in other one of the first redistribution structure and the second redistribution structure and overlapped with the insulating encapsulation and offset from the die in the vertical projection, 
 wherein a width of the second reinforcement structure is greater than the a width of the second connecting structure. 
 
     
     
       4. The package structure of  claim 3 , wherein the second reinforcement structure comprises:
 a first structure extends along a portion of an edge of the die; 
 a second structure extends outward from a corner of the die; or 
 a first structure extends along a portion of an edge of the die and a second structure extends outward from a corner of the die. 
 
     
     
       5. The package structure of  claim 1 , further comprising at least one of:
 a plurality of conductive terminals, disposed on and connected to one of the first redistribution structure and the second redistribution structure; and 
 at least one semiconductor device, disposed on and connected to one of the first redistribution structure and the second redistribution structure. 
 
     
     
       6. A package structure, comprising:
 a semiconductor die, disposed over a redistribution circuit structure; 
 a reinforcement structure, embedded in the redistribution circuit structure, the reinforcement structure being partially overlapped with the semiconductor die, wherein the reinforcement structure extends along a portion of an edge of the semiconductor die; and 
 a connecting structure, embedded in the redistribution circuit structure, wherein a projection of the connecting structure is laterally spacing from a projection of the semiconductor die, wherein in a vertical projection, a width of the reinforcement structure is greater than a width of the connecting structure. 
 
     
     
       7. The package structure of  claim 6 , wherein the reinforcement structure comprises a plurality of reinforcement structures each partially overlapped with the semiconductor die and respectively extends along a portion of each edge of the semiconductor die. 
     
     
       8. The package structure of  claim 6 , further comprising:
 at least another reinforcement structure, embedded in and electrically coupled to the redistribution circuit structure, the at least another reinforcement structure being partially overlapped with the semiconductor die, wherein the at least another reinforcement structure extends outward from a corner of the semiconductor die. 
 
     
     
       9. The package structure of  claim 8 , wherein in the vertical projection, a width of the at least another reinforcement structure is greater than the width of the connecting structure. 
     
     
       10. The package structure of  claim 6 , further comprising:
 an additional redistribution circuit structure, disposed over the semiconductor die; and 
 a plurality of vertical connections, laterally spacing from the semiconductor die and electrically connecting the redistribution circuit structure and the additional redistribution circuit structure, 
 wherein: 
 the redistribution circuit structure is connected to an active side of the semiconductor die, 
 the additional redistribution circuit structure is connected to a rear side of the semiconductor die, and the rear side is opposite to the active side along a stacking direction of the redistribution circuit structure and the semiconductor die, and 
 the additional redistribution circuit structure is electrically coupled to the semiconductor die through the redistribution circuit structure and the plurality of vertical connections. 
 
     
     
       11. The package structure of  claim 6 , further comprising:
 an additional redistribution circuit structure, disposed over the semiconductor die; and 
 a plurality of vertical connections, laterally spacing from the semiconductor die and electrically connecting the redistribution circuit structure and the additional redistribution circuit structure, 
 wherein: 
 the redistribution circuit structure is connected to a rear side of the semiconductor die, 
 the additional redistribution circuit structure is connected to an active side of the semiconductor die, and the rear side is opposite to the active side along a stacking direction of the redistribution circuit structure and the semiconductor die, and 
 the redistribution circuit structure is electrically coupled to the semiconductor die through the additional redistribution circuit structure and the plurality of vertical connections. 
 
     
     
       12. The package structure of  claim 6 , further comprising:
 an additional redistribution circuit structure, disposed over the semiconductor die; 
 an additional reinforcement structure, embedded in the additional redistribution circuit structure, the additional reinforcement structure being partially overlapped with the semiconductor die; 
 an additional connecting structure, embedded in the additional redistribution circuit structure, wherein a projection of the additional connecting structure is laterally spacing from the projection of the semiconductor die, wherein in the vertical projection, a width of the additional reinforcement structure is greater than a width of the additional connecting structure; and 
 a plurality of vertical connections, laterally spacing from the semiconductor die and electrically connecting the redistribution circuit structure and the additional redistribution circuit structure, 
 wherein one of the redistribution circuit structure and the additional redistribution circuit structure is electrically coupled to the semiconductor die through the plurality of vertical connections and other one of the redistribution circuit structure and the additional redistribution circuit structure. 
 
     
     
       13. The package structure of  claim 12 , wherein the additional reinforcement structure comprise:
 a first reinforcement structure extends along a portion of another edge of the semiconductor die; 
 a second reinforcement structure extends outward from a corner of the semiconductor die; or 
 a first reinforcement structure extends along a portion of another edge of the semiconductor die and a second reinforcement structure extends outward from a corner of the semiconductor die. 
 
     
     
       14. A package structure, comprising:
 a first redistribution structure; 
 a die, disposed over and electrically coupled to the first redistribution structure; 
 an insulating encapsulation, encapsulating the die; 
 a first reinforcement structure, embedded in the first redistribution structure and overlapped with the die and the insulating encapsulation in a vertical projection; 
 a first connecting structure, embedded in the first redistribution structure and overlapped with the insulating encapsulation and offset from the die in the vertical projection, wherein a width of the first reinforcement structure is greater than the a width of the first connecting structure; 
 an antenna element, disposed over the first redistribution structure and electrically coupled to the die; and 
 an encapsulant, disposed between the antenna element and the die. 
 
     
     
       15. The package structure of  claim 14 , wherein the first reinforcement structure comprises:
 a first structure extends along a portion of an edge of the die; 
 a second structure extends outward from a corner of the die; or 
 a first structure extends along a portion of an edge of the die and a second structure extends outward from a corner of the die. 
 
     
     
       16. The package structure of  claim 14 , further comprising:
 a second redistribution structure, disposed over the die, wherein the insulating encapsulation is interposed between the first redistribution structure and the second redistribution structure; 
 a plurality of conductive pillars, next to the die and penetrating through the insulating encapsulation, the plurality of conductive pillars electrically connecting the first redistribution structure and the second redistribution structure; 
 a second reinforcement structure, embedded in other one of the first redistribution structure and the second redistribution structure and overlapped with the die and the insulating encapsulation in a vertical projection; and 
 a second connecting structure, embedded in other one of the first redistribution structure and the second redistribution structure and overlapped with the insulating encapsulation and offset from the die in the vertical projection, 
 wherein a width of the second reinforcement structure is greater than the a width of the second connecting structure. 
 
     
     
       17. The package structure of  claim 16 , wherein the second reinforcement structure comprises:
 a first structure extends along a portion of an edge of the die; 
 a second structure extends outward from a corner of the die; or 
 a first structure extends along a portion of an edge of the die and a second structure extends outward from a corner of the die. 
 
     
     
       18. The package structure of  claim 14 , further comprising at least one of:
 a plurality of conductive terminals, disposed on and connected to one of the first redistribution structure and the second redistribution structure; and 
 at least one semiconductor device, disposed on and connected to one of the first redistribution structure and the second redistribution structure. 
 
     
     
       19. The package structure of  claim 14 , wherein the antenna element is a patch antenna. 
     
     
       20. The package structure of  claim 14 , further comprising:
 a plurality of dipole antennas, arranged along the periphery of the package structure and next to the die, wherein the plurality of dipole antennas are embedded in the insulating encapsulation and electrically coupled to the die.