Inventor · disambiguated record
Chun-Lin Lu
Also filed as: LU CHUN-LIN
80 granted patents·22 pending applications·220 citations·filing 2009–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD68POWERCHIP SEMICONDUCTOR MFG CORP18TAIWAN SEMICONDUCTOR MFG6NANYA TECHNOLOGY CORP2SOLTEAM OPTO INC2
Top patents by PatentIndex Score
102 records- 0197US11824005B2Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 21, 2023·2 cites·20 claims
- 0297US9412661B2Method for forming package-on-package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Aug 9, 2016·50 cites·12 claims
- 0396US11908787B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 20, 2024·2 cites·20 claims
- 0495US11398422B2Package structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 26, 2022·3 cites·20 claims
- 0595US10825773B2Package structure with reinforcement structures in a redistribution circuit structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 3, 2020·8 cites·20 claims
- 0695US10529666B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 7, 2020·10 cites·17 claims
- 0794US11424197B2Package, package structure with redistributing circuits and antenna elements and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 23, 2022·8 cites·20 claims
- 0894US9966321B2Methods and apparatus for package with interposersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 8, 2018·8 cites·20 claims
- 0992US11342269B2Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·2 cites·20 claims
- 1091US10868353B2Electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·7 cites·9 claims
- 1191US2025364272A1Semiconductor device and manufacturing method thereofPARABELLUM STRATEGIC OPPORTUNITIES FUND LLC·Filed 2025·Application pending·0 cites
- 1290US11264316B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 1, 2022·4 cites·20 claims
- 1390US10043761B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 7, 2018·5 cites·20 claims
- 1490US8008850B2Color temperature tunable white light emitting deviceUNIV NAT TAIWAN SCIENCE TECH·Filed 2009·Granted Aug 30, 2011·24 cites·17 claims
- 1589US10510714B2Packaged semiconductor devices and packaging methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·4 cites·20 claims
- 1689US9659879B1Semiconductor device having a guard ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 23, 2017·7 cites·20 claims
- 1789US9497861B2Methods and apparatus for package with interposersTAIWAN SEMIDONDUCTOR MFG COMPANY LTD·Filed 2012·Granted Nov 15, 2016·10 cites·20 claims
- 1888US12322670B2Methods and apparatus for package with interposersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 3, 2025·1 cites·20 claims
- 1988US10050013B2Packaged semiconductor devices and packaging methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 14, 2018·5 cites·20 claims
- 2087US10153240B2Method of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 11, 2018·4 cites·20 claims
- 2187US8994176B2Methods and apparatus for package with interposersTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Mar 31, 2015·6 cites·20 claims
- 2286US10510693B2Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·4 cites·20 claims
- 2386US9806045B2Interconnection structure including a metal post encapsulated by solder joint having a concave outer surfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 31, 2017·6 cites·20 claims
- 2485US12322691B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 3, 2025·0 cites·20 claims
- 2585US11114357B2Methods and apparatus for package with interposersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 7, 2021·2 cites·20 claims
- 2685US2025273556A1Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2783US11362009B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·1 cites·11 claims
- 2883US10867952B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 15, 2020·1 cites·20 claims
- 2983US10692832B2Manufacturing method of semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 23, 2020·2 cites·20 claims
- 3083US9209140B2Semiconductor devices and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 8, 2015·3 cites·20 claims
- 3182US12119303B2Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
- 3282US11211358B2Packaged semiconductor devices and packaging methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·2 cites·20 claims
- 3382US2024379382A1Manufacturing method of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3481US10381309B2Package structure having connecting moduleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 13, 2019·3 cites·8 claims
- 3581US9559071B2Mechanisms for forming hybrid bonding structures with elongated bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 31, 2017·4 cites·18 claims
- 3680US11569562B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 31, 2023·1 cites·20 claims
- 3780US11004810B2Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·2 cites·20 claims
- 3880US9355982B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 31, 2016·3 cites·19 claims
- 3980US2024088053A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4079US2024363459A1Package structure with antenna pattern and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4178US11101238B2Surface mounting semiconductor componentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·2 cites·20 claims
- 4278US9601439B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 21, 2017·3 cites·20 claims
- 4378US2024387979A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4477US11742219B2Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 29, 2023·0 cites·20 claims
- 4577US10510681B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·1 cites·20 claims
- 4676US12057358B2Package structure with antenna patternTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 4775US12512424B2Package, package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 4875US11854992B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 4975US10522437B2Methods and apparatus for package with interposersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·1 cites·20 claims
- 5074US12132247B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 29, 2024·0 cites·20 claims
Showing the top 50 of 102 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →