Inventor · disambiguated record
Chen-Hua Yu
Also filed as: YU CHEN · YU CHEN-HUA · YU CHEN-HUA D · YU CHEN-HUA DOUGLAS
1,978 granted patents·434 pending applications·37,239 citations·filing 1990–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD1,702TAIWAN SEMICONDUCTOR MFG401YU CHEN-HUA98CHEN DING-YUAN15LIN JING-CHENG14
Top patents by PatentIndex Score
2,412 records- 0199US11852868B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·7 cites·20 claims
- 0299US11784140B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 10, 2023·4 cites·20 claims
- 0399US11721559B2Integrated circuit package pad and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 8, 2023·4 cites·20 claims
- 0499US11651994B2Processes for reducing leakage and improving adhesionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 16, 2023·5 cites·20 claims
- 0599US11587916B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·8 cites·20 claims
- 0699US11581281B2Packaged semiconductor device and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 14, 2023·10 cites·20 claims
- 0799US11527419B2Photonic integrated package and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·7 cites·20 claims
- 0899US11508695B2Redistribution layers in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 22, 2022·7 cites·20 claims
- 0999US11502072B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 15, 2022·7 cites·19 claims
- 1099US11493689B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·18 cites·20 claims
- 1199US11454888B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·6 cites·20 claims
- 1299US11417580B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·9 cites·20 claims
- 1399US11315805B2Cross-wafer RDLs in constructed wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 26, 2022·7 cites·20 claims
- 1499US11295979B2Semiconductor package device with integrated antenna and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 5, 2022·7 cites·20 claims
- 1599US10784248B2Multi-stack package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 22, 2020·46 cites·20 claims
- 1699US10658337B2Packages and packaging methods for semiconductor devices, and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 19, 2020·37 cites·20 claims
- 1799US10541228B2Packages formed using RDL-last processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 21, 2020·51 cites·20 claims
- 1899US10541227B2System on integrated chips and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 21, 2020·47 cites·20 claims
- 1999US10522449B2Packages with Si-substrate-free interposer and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 31, 2019·57 cites·20 claims
- 2099US10510650B2Method of manufacturing semiconductor device packaging structure having through interposer vias and through substrate viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·67 cites·20 claims
- 2199US10510634B2Package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·58 cites·20 claims
- 2299US10510629B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·38 cites·20 claims
- 2399US10504835B1Package structure, semiconductor chip and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·64 cites·20 claims
- 2499US10490540B2Multi-stack package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 26, 2019·44 cites·20 claims
- 2599US10340249B1Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 2, 2019·57 cites·20 claims
- 2699US10290611B2Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 14, 2019·50 cites·20 claims
- 2799US10269773B1Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·45 cites·20 claims
- 2899US10162139B1Semicondcutor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·96 cites·20 claims
- 2999US10153222B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 11, 2018·79 cites·20 claims
- 3099US10062648B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 28, 2018·70 cites·19 claims
- 3199US10056351B2Fan-out stacked system in package (SIP) and the methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 21, 2018·68 cites·20 claims
- 3299US10037963B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 31, 2018·56 cites·20 claims
- 3399US10032722B2Semiconductor package structure having am antenna pattern and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 24, 2018·45 cites·9 claims
- 3499US9997464B2Dummy features in redistribution layers (RDLS) and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 12, 2018·64 cites·20 claims
- 3599US9899248B2Method of forming semiconductor packages having through package viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 20, 2018·73 cites·20 claims
- 3699US9881850B2Package structures and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 30, 2018·56 cites·20 claims
- 3799US9859254B1Semiconductor structure and a manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·102 cites·20 claims
- 3899US9859206B2Photoactive compound gradient photoresistTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 2, 2018·70 cites·20 claims
- 3999US9831148B2Integrated fan-out package including voltage regulators and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 28, 2017·104 cites·20 claims
- 4099US9818720B2Structure and formation method for chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 14, 2017·53 cites·20 claims
- 4199US9812337B2Integrated circuit package pad and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 7, 2017·66 cites·20 claims
- 4299US9806058B2Chip package having die structures of different heights and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 31, 2017·60 cites·20 claims
- 4399US9793230B1Semiconductor structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 17, 2017·33 cites·20 claims
- 4499US9773757B2Devices, packaged semiconductor devices, and semiconductor device packaging methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 26, 2017·86 cites·20 claims
- 4599US9768145B2Methods of forming multi-die package structures including redistribution layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 19, 2017·47 cites·20 claims
- 4699US9741690B1Redistribution layers in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 22, 2017·52 cites·20 claims
- 4799US9735131B2Multi-stack package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 15, 2017·721 cites·20 claims
- 4899US9653433B2Multi-chip structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 16, 2017·38 cites·20 claims
- 4999US9627365B1Tri-layer CoWoS structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 18, 2017·155 cites·20 claims
- 5099US9524959B1System on integrated chips and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 20, 2016·67 cites·20 claims
Showing the top 50 of 2,412 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →