P

Inventor

KIM TAESUNG

US122 patents
⚠️ This page may combine multiple inventors who share the name “KIM TAESUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

14 patents
US10552696B2Feb 4, 2020

Electronic device having a biometric sensor

SAMSUNG ELECTRONICS CO LTD16 citations93
US10845904B2Nov 24, 2020

Display comprising sensing function, and electronic device comprising same

SAMSUNG ELECTRONICS CO LTD3 citations73
US11521410B2Dec 6, 2022

Electronic device having a biometric sensor

SAMSUNG ELECTRONICS CO LTD3 citations72
US11310856B2Apr 19, 2022

Method and apparatus for performing dual connectivity in heterogeneous network

SAMSUNG ELECTRONICS CO LTD5 citations72
US11163336B2Nov 2, 2021

Flexible display device and method for controlling display

SAMSUNG ELECTRONICS CO LTD2 citations72
US11084250B2Aug 10, 2021

Display and electronic device comprising same

SAMSUNG ELECTRONICS CO LTD6 citations72
US10065402B2Sep 4, 2018

Method of manufacturing pellicle assembly and method of photomask assembly including the same

SAMSUNG ELECTRONICS CO LTD5 citations72
US11024693B2Jun 1, 2021

Flexible display and electronic device including same

SAMSUNG ELECTRONICS CO LTD3 citations71
US10885301B2Jan 5, 2021

Method for obtaining biometric information and electronic device thereof

SAMSUNG ELECTRONICS CO LTD2 citations71
US10878215B2Dec 29, 2020

Electronic device having a biometric sensor

SAMSUNG ELECTRONICS CO LTD2 citations71
US11813714B2Nov 14, 2023

Chemical mechanical polishing pad and chemical mechanical polishing apparatus including the same

SAMSUNG ELECTRONICS CO LTD3 citations65
US12284706B2Apr 22, 2025

Method and apparatus for performing dual connectivity in heterogeneous network

SAMSUNG ELECTRONICS CO LTD1 citations63
US12243755B2Mar 4, 2025

Carrier film disposed on a mother substrate and method of manufacturing a semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations63
US11764079B2Sep 19, 2023

Carrier film, mother substrate, and method of manufacturing semiconductor package by using the carrier film and the mother substrate

SAMSUNG ELECTRONICS CO LTD0 citations63

SEMICONDUCTOR COMPONENTS IND LLC

8 patents

KIM TAESUNG

7 patents

APPLE INC

6 patents

FAIRCHILD KOREA SEMICONDUCTOR LTD

5 patents

SAMSUNG DISPLAY CO LTD

5 patents

ELECTRONICS AND TELECOMUNICATI

1 patent

KOREA ELECTRONICS TELECOMM

1 patent

HITACHI AUTOMOTIVE SYSTEMS LTD

1 patent

INTEL CORP

1 patent

FAIRCHILD KR SEMICONDUCTOR LTD

1 patent

Showing the top 50 of 122 patents by PatentIndex Score.