Inventor
AHN JONG-HYON
KR33 patents
⚠️ This page may combine multiple inventors who share the name “AHN JONG-HYON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
32 patentsUS6300233B1Oct 9, 2001
Method of making a fuse in a semiconductor device
SAMSUNG ELECTRONICS CO LTD28 citations93
US6175145B1Jan 16, 2001
Method of making a fuse in a semiconductor device and a semiconductor device having a fuse
SAMSUNG ELECTRONICS CO LTD23 citations93
US6074940AJun 13, 2000
Method of making a fuse in a semiconductor device and a semiconductor device having a fuse
SAMSUNG ELECTRONICS CO LTD28 citations93
US7585734B2Sep 8, 2009
Method of fabricating multi-gate transistor and multi-gate transistor fabricated thereby
SAMSUNG ELECTRONICS CO LTD45 citations92
US7045896B2May 16, 2006
Metal interconnect layer of semiconductor device and method for forming a metal interconnect layer
SAMSUNG ELECTRONICS CO LTD26 citations92
US6765255B2Jul 20, 2004
Semiconductor device having metal-insulator-metal capacitor and fabrication method thereof
SAMSUNG ELECTRONICS CO LTD39 citations92
US6548862B2Apr 15, 2003
Structure of semiconductor device and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD24 citations92
US6465337B1Oct 15, 2002
Methods of fabricating integrated circuit bonding pads including intermediate closed conductive layers having spaced apart insulating islands therein
SAMSUNG ELECTRONICS CO LTD18 citations92
US6163074ADec 19, 2000
Integrated circuit bonding pads including intermediate closed conductive layers having spaced apart insulating islands therein
SAMSUNG ELECTRONICS CO LTD39 citations92
US7361565B2Apr 22, 2008
Method of forming a metal gate in a semiconductor device
SAMSUNG ELECTRONICS CO LTD31 citations90
US6552438B2Apr 22, 2003
Integrated circuit bonding pads including conductive layers with arrays of unaligned spaced apart insulating islands therein and methods of forming same
SAMSUNG ELECTRONICS CO LTD34 citations88
US7486543B2Feb 3, 2009
Asymmetrical SRAM device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD10 citations83
US7008835B2Mar 7, 2006
Method of manufacturing a semiconductor device having a gate structure with low parasitic capacitance
SAMSUNG ELECTRONICS CO LTD13 citations83
US6232189B1May 15, 2001
Manufacturing method of semiconductor device
SAMSUNG ELECTRONICS CO LTD17 citations83
US6768199B2Jul 27, 2004
Flip chip type semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD17 citations81
US6335567B1Jan 1, 2002
Semiconductor device having stress reducing laminate and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD8 citations74
US5612246AMar 18, 1997
Method for manufacturing semiconductor substrate having buck transistor and SOI transistor areas
SAMSUNG ELECTRONICS CO LTD11 citations74
US6960785B2Nov 1, 2005
MOSFET and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD10 citations73
US6764910B2Jul 20, 2004
Structure of semiconductor device and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD6 citations73
US7288848B2Oct 30, 2007
Overlay mark for measuring and correcting alignment errors
SAMSUNG ELECTRONICS CO LTD7 citations72
US6555462B2Apr 29, 2003
Semiconductor device having stress reducing laminate and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations63
US6482662B1Nov 19, 2002
Semiconductor device fabricating method
SAMSUNG ELECTRONICS CO LTD6 citations63
US6285540B1Sep 4, 2001
Semiconductor device having a fuse
SAMSUNG ELECTRONICS CO LTD3 citations63
US7696051B2Apr 13, 2010
Method of fabricating a MOSFET having doped epitaxially grown source/drain region on recessed substrate
SAMSUNG ELECTRONICS CO LTD5 citations62
US7544991B2Jun 9, 2009
Non-volatile memory device and methods of manufacturing and operating the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US7332400B2Feb 19, 2008
Method of manufacturing a semiconductor device having a gate structure with low parasitic capacitance
SAMSUNG ELECTRONICS CO LTD2 citations62
US7358588B2Apr 15, 2008
Trench isolation type semiconductor device which prevents a recess from being formed in a field region
SAMSUNG ELECTRONICS CO LTD3 citations61
US7579236B2Aug 25, 2009
Nonvolatile memory device, method of fabricating and method of operating the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US7364987B2Apr 29, 2008
Method for manufacturing semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations51
US7795110B2Sep 14, 2010
Trench isolation type semiconductor device which prevents a recess from being formed in a field region and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations50
US7709340B2May 4, 2010
Semiconductor integrated circuit device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations47
US7569480B2Aug 4, 2009
Semiconductor devices and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations47