Inventor
LEE HYAE-RYOUNG
KR9 patents
Patents
9 patentsUS6222270B1Apr 24, 2001
Integrated circuit bonding pads including closed vias and closed conductive patterns
SAMSUNG ELECTRONICS CO LTD191 citations97
US6541328B2Apr 1, 2003
Method of fabricating metal oxide semiconductor transistor with lightly doped impurity regions formed after removing spacers used for defining higher density impurity regions
SAMSUNG ELECTRONICS CO LTD125 citations95
US6465337B1Oct 15, 2002
Methods of fabricating integrated circuit bonding pads including intermediate closed conductive layers having spaced apart insulating islands therein
SAMSUNG ELECTRONICS CO LTD18 citations92
US6163074ADec 19, 2000
Integrated circuit bonding pads including intermediate closed conductive layers having spaced apart insulating islands therein
SAMSUNG ELECTRONICS CO LTD39 citations92
US6597032B1Jul 22, 2003
Metal-insulator-metal (MIM) capacitors
SAMSUNG ELECTRONICS CO LTD33 citations91
US6569746B2May 27, 2003
Methods of forming integrated circuit capacitors having electrodes therein that comprise conductive plugs
SAMSUNG ELECTRONICS CO LTD23 citations91
US6184551B1Feb 6, 2001
Method of forming integrated circuit capacitors having electrodes therein that comprise conductive plugs
SAMSUNG ELECTRONICS CO LTD44 citations91
US6552438B2Apr 22, 2003
Integrated circuit bonding pads including conductive layers with arrays of unaligned spaced apart insulating islands therein and methods of forming same
SAMSUNG ELECTRONICS CO LTD34 citations88
US7534677B2May 19, 2009
Method of fabricating a dual gate oxide
SAMSUNG ELECTRONICS CO LTD0 citations43