Inventor
KAYABA YASUHISA
JP16 patents
Patents
16 patentsUS10752805B2Aug 25, 2020
Semiconductor film composition, method for manufacturing semiconductor film composition, method for manufacturing semiconductor member, method for manufacturing semiconductor processing material, and semiconductor device
MITSUI CHEMICALS INC2 citations72
US9780008B2Oct 3, 2017
Semiconductor device, method for manufacturing the same, and rinsing liquid
MITSUI CHEMICALS INC3 citations71
US12261143B2Mar 25, 2025
Method of manufacturing substrate layered body and layered body
MITSUI CHEMICALS INC0 citations62
US11965109B2Apr 23, 2024
Semiconductor film composition, method for manufacturing semiconductor film composition, method for manufacturing semiconductor member, method for manufacturing semiconductor processing material, and semiconductor device
MITSUI CHEMICALS INC0 citations62
US11859110B2Jan 2, 2024
Substrate laminated body and method of manufacturing substrate laminated body
MITSUI CHEMICALS INC0 citations62
US11487205B2Nov 1, 2022
Semiconductor element intermediate, composition for forming metal-containing film, method of producing semiconductor element intermediate, and method of producing semiconductor element
MITSUI CHEMICALS INC0 citations61
US10950532B2Mar 16, 2021
Substrate intermediary body, through-hole via electrode substrate, and through-hole via electrode formation method
MITSUI CHEMICALS INC0 citations61
US9169353B2Oct 27, 2015
Sealing composition for semiconductor, semiconductor device and method of producing the same, and polymer and method of producing the same
MITSUI CHEMICALS INC2 citations61
US11209735B2Dec 28, 2021
Composition for forming metal-containing film, method of producing composition for forming metal-containing film, semiconductor device, and method of producing semiconductor device
MITSUI CHEMICALS INC0 citations50
US10759964B2Sep 1, 2020
Semiconductor film composition, method of manufacturing semiconductor film composition, method of manufacturing semiconductor member, method of manufacturing semiconductor processing material, and semiconductor device
MITSUI CHEMICALS INC0 citations50
US10580639B2Mar 3, 2020
Sealing composition and method of manufacturing semiconductor device
MITSUI CHEMICALS INC0 citations50
US10043677B2Aug 7, 2018
Method for manufacturing filling planarization film and method for manufacturing electronic device
MITSUI CHEMICALS INC0 citations50
US11581197B2Feb 14, 2023
Method for producing semiconductor device and intermediate for semiconductor device
MITSUI CHEMICALS INC0 citations49
US10988647B2Apr 27, 2021
Semiconductor substrate manufacturing method, semiconductor device, and method for manufacturing same
MITSUI CHEMICALS INC0 citations47
US11474429B2Oct 18, 2022
Method of producing substrate with fine uneven pattern, resin composition, and laminate
MITSUI CHEMICALS INC0 citations45
US10020238B2Jul 10, 2018
Method for manufacturing composite body and composition
MITSUI CHEMICALS INC0 citations40