Inventor

KWON YONG-TAE

KR34 patents

⚠️ This page may combine multiple inventors who share the name “KWON YONG-TAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KWON YONG-TAE

NEPES CO LTD

Semiconductor package, fabrication method therefor, and package-on package

Semiconductor package and method of manufacturing the same

Semiconductor package and manufacturing method thereof

Stacked semiconductor package and manufacturing method thereof

Method for producing semiconductor package

Semiconductor package and method of manufacturing same

Semiconductor package

Semiconductor package and manufacturing method thereof

Semiconductor package and method for manufacturing same

Wafer-level design and wiring pattern for a semiconductor package

Semiconductor package comprising first molding layer and second molding layer with different thermal expansion coefficients

Semiconductor package including redistribution structure, and method of manufacturing the same

Manufacturing method for semiconductor package including filling member and membrane member

Semiconductor package and method for manufacturing the same

Semiconductor package and method for manufacturing the same

AUTOTAC INC

Compound as a UBR box domain ligand

Compound as a UBR box domain ligand

P62 ligand compound, and composition for preventing, ameliorating or treating proteinopathies comprising the same

AUTOTAC chimeric compound, and composition for preventing, ameliorating or treating diseases through targeted protein degradation comprising the same

P62 ligand compound, and composition for preventing, ameliorating or treating proteinopathies comprising the same

Benzyloxy pyridine derivatives and uses thereof

CALIFORNIA INST OF TECHN

Nucleic acid encoding mammalian Ubr1

Nucleic acid encoding mammalian UBR1

Modulation of angiogenesis through targeting of arginyl transferase (ATE1)

Modulation of nitric oxide signaling through signaling through specific regulation by arginylation and the N-end rule pathway

HYUNDAI ELECTRONICS IND

Integrated device package and fabrication methods thereof

Wire arrayed chip size package

Integrated device package and fabrication methods thereof

SEOUL NAT UNIV R&DB FOUNDATION

Prevention and treatment of neurodegenerative diseases through autophagy activity mediated by a synthetic ligand or arginylated BIP binding to the P62 ZZ domain

Compound and pharmaceutical composition for preventing or treating obesity or metabolic syndrome comprising thereof

Cargo delivery system and composition comprising the same

HYNIX SEMICONDUCTUR INC

Method of fabricating a wire arrayed chip size package

LG SEMICON CO LTD

Ball grid array (BGA) semiconductor package member

KWON YONG-TAE

Semiconductor chip package having via hole and semiconductor module thereof