Inventor
LEE JUN-KYU
KR32 patents
⚠️ This page may combine multiple inventors who share the name “LEE JUN-KYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEPES CO LTD
12 patentsUS9653397B2May 16, 2017
Semiconductor package and method of manufacturing the same
NEPES CO LTD14 citations83
US11011502B2May 18, 2021
Semiconductor package
NEPES CO LTD6 citations72
US9793251B2Oct 17, 2017
Semiconductor package and manufacturing method thereof
NEPES CO LTD2 citations72
US9754892B2Sep 5, 2017
Stacked semiconductor package and manufacturing method thereof
NEPES CO LTD4 citations72
US10381312B2Aug 13, 2019
Semiconductor package and method of manufacturing the same
NEPES CO LTD2 citations69
US10957654B2Mar 23, 2021
Semiconductor package and method of manufacturing the same
NEPES CO LTD5 citations66
US11476211B2Oct 18, 2022
Semiconductor package and manufacturing method thereof
NEPES CO LTD1 citations60
US12525547B2Jan 13, 2026
Semiconductor package and method for manufacturing same
NEPES CO LTD0 citations50
US12205904B2Jan 21, 2025
Wafer-level design and wiring pattern for a semiconductor package
NEPES CO LTD0 citations46
US12198997B2Jan 14, 2025
Semiconductor package comprising first molding layer and second molding layer with different thermal expansion coefficients
NEPES CO LTD0 citations46
US11264330B2Mar 1, 2022
Chip package with connection portion that passes through an encapsulation portion
NEPES CO LTD0 citations45
US11450535B2Sep 20, 2022
Manufacturing method for semiconductor package including filling member and membrane member
NEPES CO LTD0 citations44
SOLUM CO LTD
6 patentsUS10468895B2Nov 5, 2019
Charger with improved heat radiation and the manufacturing method thereof
SOLUM CO LTD2 citations72
US12334694B2Jun 17, 2025
Electric appliance and adapter
SOLUM CO LTD0 citations58
US11955755B2Apr 9, 2024
Electric appliance and adapter
SOLUM CO LTD0 citations58
US12028985B2Jul 2, 2024
Electrical device having heat dissipation structure using filler and manufacturing method of the same
SOLUM CO LTD0 citations47
US11825599B2Nov 21, 2023
Air-pocket prevention PCB, air-pocket prevention PCB module, electrical device including the same, and manufacturing method of electrical device including the same
SOLUM CO LTD0 citations47
US11783989B2Oct 10, 2023
Transformer
SOLUM CO LTD0 citations46
SAMSUNG ELECTRONICS CO LTD
3 patentsUS5901716AMay 11, 1999
Wafer cleaning apparatus with rotating cleaning solution injection nozzles
SAMSUNG ELECTRONICS CO LTD20 citations92
US12557590B2Feb 17, 2026
Substrate transfer device, substrate transfer system and substrate transfer method
SAMSUNG ELECTRONICS CO LTD0 citations46
US10880610B2Dec 29, 2020
Method for providing additional contents at terminal, and terminal using same
SAMSUNG ELECTRONICS CO LTD0 citations36
UPPTHERA INC
2 patentsUNIV KOREA RES & BUS FOUND
2 patentsUS10799955B2Oct 13, 2020
Method of manufacturing metal powders and apparatus for manufacturing metal powders realizing the same
UNIV KOREA RES & BUS FOUND0 citations48
US9855605B2Jan 2, 2018
Method of manufacturing metal powders and apparatus for manufacturing metal powders realizing the same
UNIV KOREA RES & BUS FOUND0 citations48