Inventor

HUNG LI-CHUN

TW29 patents

⚠️ This page may combine multiple inventors who share the name “HUNG LI-CHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KINGPAK TECH INC

17 patents

US10964615B2Mar 30, 2021

Chip-scale sensor package structure

KINGPAK TECH INC2 citations73

US12119363B2Oct 15, 2024

Sensor package structure

KINGPAK TECH INC2 citations72

US12108517B2Oct 1, 2024

Sensor lens assembly having non-soldering configuration

KINGPAK TECH INC2 citations72

US11257964B2Feb 22, 2022

Sensor package structure

KINGPAK TECH INC2 citations72

US11133348B2Sep 28, 2021

Sensor package structure and sensing module thereof

KINGPAK TECH INC3 citations72

US10411055B2Sep 10, 2019

Sensor package structure

KINGPAK TECH INC2 citations71

US10340250B2Jul 2, 2019

Stack type sensor package structure

KINGPAK TECH INC6 citations71

US11227885B2Jan 18, 2022

Image sensor package with particle blocking dam

KINGPAK TECH INC1 citations62

US10700111B2Jun 30, 2020

Optical sensor

KINGPAK TECH INC1 citations62

US10825851B2Nov 3, 2020

Sensor package structure

KINGPAK TECH INC1 citations61

US12224299B2Feb 11, 2025

Sensor package structure

KINGPAK TECH INC0 citations52

US12174446B2Dec 24, 2024

Sensor lens assembly having non-soldering configuration

KINGPAK TECH INC0 citations51

US12113082B2Oct 8, 2024

Sensor package structure

KINGPAK TECH INC0 citations51

US12080659B2Sep 3, 2024

Sensor package structure

KINGPAK TECH INC0 citations51

US11552120B2Jan 10, 2023

Chip-scale sensor package structure

KINGPAK TECH INC0 citations51

US12376399B2Jul 29, 2025

Sensor package structure

KINGPAK TECH INC0 citations47

US10600830B2Mar 24, 2020

Sensor package structure

KINGPAK TECH INC0 citations40

TONG HSING ELECTRONIC INDUSTRIES LTD

9 patents

US11967652B2Apr 23, 2024

Sensor package structure having solder mask frame

TONG HSING ELECTRONIC INDUSTRIES LTD1 citations71

US12224359B2Feb 11, 2025

Sensor package structure having solder mask frame

TONG HSING ELECTRONIC INDUSTRIES LTD0 citations60

US11984516B2May 14, 2024

Sensor package structure having ring-shaped solder mask frame

TONG HSING ELECTRONIC INDUSTRIES LTD0 citations60

US12356742B2Jul 8, 2025

Chip packaging structure and chip packaging method

TONG HSING ELECTRONIC INDUSTRIES LTD0 citations55

US12490541B2Dec 2, 2025

Sensor package structure

TONG HSING ELECTRONIC INDUSTRIES LTD0 citations51

US12189152B2Jan 7, 2025

Sensor lens assembly

TONG HSING ELECTRONIC INDUSTRIES LTD0 citations51

US12177996B2Dec 24, 2024

Sensor package structure

TONG HSING ELECTRONIC INDUSTRIES LTD0 citations51

US12575204B2Mar 10, 2026

Sensor package structure and manufacturing method thereof

TONG HSING ELECTRONIC INDUSTRIES LTD0 citations50

US12538598B2Jan 27, 2026

Chip package structure and method for fabricating the same

TONG HSING ELECTRONIC INDUSTRIES LTD0 citations44

TAIWAN SEMICONDUCTOR MFG CO LTD

2 patents

US12417992B2Sep 16, 2025

Chip structure with conductive pillar and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60

US11688708B2Jun 27, 2023

Chip structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60

TONG HSING ELECTRONIC IND LTD

1 patent

US12598821B2Apr 7, 2026

Chip package structure and method for producing the same

TONG HSING ELECTRONIC IND LTD0 citations46