P

Inventor

CHANG HUICHENG

TW216 patents
⚠️ This page may combine multiple inventors who share the name “CHANG HUICHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

43 patents
US10347762B1Jul 9, 2019

Field effect transistor contact with reduced contact resistance using implantation process

TAIWAN SEMICONDUCTOR MFG CO LTD20 citations94
US9607838B1Mar 28, 2017

Enhanced channel strain to reduce contact resistance in NMOS FET devices

TAIWAN SEMICONDUCTOR MFG CO LTD25 citations94
US11456383B2Sep 27, 2022

Semiconductor device having a contact plug with an air gap spacer

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations86
US11508831B2Nov 22, 2022

Gate spacer structure and method of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10868142B2Dec 15, 2020

Gate spacer structure and method of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10658510B2May 19, 2020

Source/drain structure

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US10515966B2Dec 24, 2019

Enhanced channel strain to reduce contact resistance in NMOS FET devices

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10157995B2Dec 18, 2018

Integrating junction formation of transistors with contact formation

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US10115808B2Oct 30, 2018

finFET device and methods of forming

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10056383B2Aug 21, 2018

Enhanced channel strain to reduce contact resistance in NMOS FET devices

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US9812451B2Nov 7, 2017

Field effect transistor contact with reduced contact resistance

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11289417B2Mar 29, 2022

Semiconductor device and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83
US10504735B2Dec 10, 2019

Method of forming a semiconductor device by high-pressure anneal and post-anneal treatment

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations83
US10763168B2Sep 1, 2020

Semiconductor structure with doped via plug and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD10 citations82
US11978677B2May 7, 2024

Wafer positioning method and apparatus

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations75
US11908708B2Feb 20, 2024

Laser de-bonding carriers and composite carriers thereof

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations74
US11901235B2Feb 13, 2024

Ion implantation for nano-FET

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11848361B2Dec 19, 2023

Sacrificial layer for semiconductor process

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11699621B2Jul 11, 2023

Method for patterning a lanthanum containing layer

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11670683B2Jun 6, 2023

Semiconductor device with implant and method of manufacturing same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11605555B2Mar 14, 2023

Trench filling through reflowing filling material

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11594618B2Feb 28, 2023

FinFET devices and methods of forming

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11450757B2Sep 20, 2022

FinFET device and methods of forming

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11348835B2May 31, 2022

Ion implantation for nano-FET

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11257952B2Feb 22, 2022

Source/drain structure

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11257911B2Feb 22, 2022

Sacrificial layer for semiconductor process

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11227918B2Jan 18, 2022

Melt anneal source and drain regions

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10916546B2Feb 9, 2021

Enhanced channel strain to reduce contact resistance in NMOS FET devices

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10867869B2Dec 15, 2020

Method for patterning a lanthanum containing layer

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10868178B2Dec 15, 2020

Field effect transistor contact with reduced contact resistance using implantation process

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10770570B2Sep 8, 2020

FinFET device and methods of forming

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10727226B2Jul 28, 2020

Semiconductor structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10515963B2Dec 24, 2019

Field effect transistor contact with reduced contact resistance

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10504795B2Dec 10, 2019

Method for patterning a lanthanum containing layer

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10347720B2Jul 9, 2019

Doping for semiconductor device with conductive feature

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10269799B2Apr 23, 2019

Field effect transistor contact with reduced contact resistance

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9537010B2Jan 3, 2017

Semiconductor device structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11855040B2Dec 26, 2023

Ion implantation with annealing for substrate cutting

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11776814B2Oct 3, 2023

Method of forming semiconductor device by driving hydrogen into a dielectric layer from another dielectric layer

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11211289B2Dec 28, 2021

Metal loss prevention using implantation

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11145751B2Oct 12, 2021

Semiconductor structure with doped contact plug and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations72
US10950447B2Mar 16, 2021

Semiconductor device having hydrogen in a dielectric layer

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10714348B2Jul 14, 2020

Semiconductor device having hydrogen in a dielectric layer

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72

TAIWAN SEMICONDUCTOR MFG

6 patents

CHING KUO-CHENG

1 patent

Showing the top 50 of 216 patents by PatentIndex Score.