Inventor

KANEDA KENICHI

JP6 patents

⚠️ This page may combine multiple inventors who share the name “KANEDA KENICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NEC CORP

2 patents

US5302852AApr 12, 1994

Semiconductor device package having a low profile structure and high strength

NEC CORP19 citations68

US5087963AFeb 11, 1992

Glass-sealed semiconductor device

NEC CORP5 citations57

SUMITOMO BAKELITE CO

1 patent

US5284899AFeb 8, 1994

Resin paste for tight sealing

SUMITOMO BAKELITE CO18 citations71

SATO MASAKI

1 patent

US8425790B2Apr 23, 2013

Ink-jet ink composition for etching resist

SATO MASAKI4 citations60

MORIMOTO JUNPEI

1 patent

US8455765B2Jun 4, 2013

Laminated body, method of manufacturing substrate, substrate, and semiconductor device

MORIMOTO JUNPEI3 citations46

KANEDA KENICHI

1 patent

US8754337B2Jun 17, 2014

Printed wiring board fabrication method, printed wiring board, multilayer printed wiring board, and semiconductor package

KANEDA KENICHI1 citations42