Glass-sealed semiconductor device

Abstract

In a glass-sealed semiconductor device, low-melting glass is glazed on a ceramic base to fix a lead frame. A distal end portion of the lead frame, the distal end portion being connected to a semiconductor element, is fixed to the ceramic base through devitrifying glass layer.

What is claimed is: 
     
       1. A glass-sealed semiconductor device in which low-melting glass is glazed on a ceramic base to fix a lead frame, and a distal end portion of said lead frame, said distal end portion being connected to a semiconductor element and being fixed to said ceramic base through devitrifying glass layer adjacent said low-melting glass. 
     
     
       2. A device according to claim 1, wherein there are further provided low-melting glass between said devitrifying glass and said ceramic base. 
     
     
       3. A device according to claim 2, wherein said devitrifying glass and said low-melting glass are glazed in a periphery portion of a recess of said ceramic base, and said low-melting glass is extended to a region outside the peripheral portion. 
     
     
       4. A device according to claim 1, wherein said devitrifying glass is glazed in a periphery portion of a recess of said ceramic base, and said low-melting glass is glazed in a region outside the peripheral portion. 
     
     
       5. A device according to claim 1, wherein there are further provided a frame electrode on the distal end portion which is connected to a part of semiconductor element via wiring.