Inventor · disambiguated record
Kenichi Kaneda
Also filed as: KANEDA KENICHI
6 granted patents·2 pending applications·50 citations·filing 1990–2011
81Inventor score
Top patents by PatentIndex Score
8 records- 0178US8425790B2Ink-jet ink composition for etching resistSATO MASAKI·Filed 2009·Granted Apr 23, 2013·4 cites·5 claims
- 0270US5284899AResin paste for tight sealingSUMITOMO BAKELITE CO·Filed 1992·Granted Feb 8, 1994·18 cites·11 claims
- 0362US8455765B2Laminated body, method of manufacturing substrate, substrate, and semiconductor deviceMORIMOTO JUNPEI·Filed 2008·Granted Jun 4, 2013·3 cites·12 claims
- 0457US8754337B2Printed wiring board fabrication method, printed wiring board, multilayer printed wiring board, and semiconductor packageKANEDA KENICHI·Filed 2010·Granted Jun 17, 2014·1 cites·11 claims
- 0545US5302852ASemiconductor device package having a low profile structure and high strengthNEC CORP·Filed 1993·Granted Apr 12, 1994·19 cites·7 claims
- 0637US2011180208A1Method for laminating prepreg, method for producing printed wiring board and prepreg rollTACHIBANA KENYA·Filed 2011·Application pending·0 cites
- 0731US2011308848A1Resin composition for wiring board, resin sheet for wiring board, composite body, method for producing composite body, and semiconductor deviceITO YUKA·Filed 2010·Application pending·0 cites
- 0827US5087963AGlass-sealed semiconductor deviceNEC CORP·Filed 1990·Granted Feb 11, 1992·5 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →