Inventor

NAKATANI SEIICHI

JP196 patents

⚠️ This page may combine multiple inventors who share the name “NAKATANI SEIICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NAKATANI SEIICHI

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Circuit component built-in module with embedded semiconductor chip and method of manufacturing

Component built-in module and method for producing the same

Magnetic element and method of manufacturing the same

Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same

Printed circuit board and method for the manufacture of same

Multi-level semiconductor module and method for fabricating the same

Component built-in module and method for producing the same

Connection member and mount assembly and production method of the same

Method for manufacturing electric element built-in module with sealed electric element

Circuit component built-in module with embedded semiconductor chip and method of manufacturing

Component built-in module and method for producing the same

Transfer material for wiring substrate

Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink

Module with built-in electronic elements and method of manufacture thereof

Circuit component built-in module, radio device having the same, and method for producing the same

Component built-in module and method of manufacturing the same

Circuit component built-in module and method for producing the same

Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste

Two-sided printed circuit board a multi-layered printed circuit board

Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same

Component built-in module and method for producing the same

Insulation sheet, multi-layer wiring substrate and production processes thereof

Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same

Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein

Capacitor unit, method for producing the same, and solid electrolytic capacitor

Conductive paste composition for via hole filling and printed circuit board using the same

Printed circuit board and method of manufacturing the same

Dielectric paste and method of manufacturing the paste

Printed circuit board and method manufacturing the same

Circuit component built-in module and method for producing the same

Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same

Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same

Conductive resin composition containing zinc oxide whiskers having a tetrapod structure

Method for producing multilayered ceramic substrate

Electronic component built-in module and method of manufacturing the same

Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same

Component built-in module and method for producing the same

Electronic component packaging structure and method for producing the same

Module with a built-in semiconductor and method for producing the same

Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same

Power module and method of manufacturing the same

Power module with improved heat dissipation

Method for producing a capacitor-embedded circuit board

Thermal conductive substrate and semiconductor module using the same

Method of manufacturing a component built-in module

Wiring substrate produced by transfer material method

PANASONIC CORP

Method for producing connection member

Module and mounted structure using the same

MATSUSHITA ELECTRONICS CORP

Semiconductor device

Semiconductor device and method of manufacturing the same