Inventor
MOCHIDA TOORU
JP22 patents
Patents
22 patentsUS6619530B2Sep 16, 2003
Wire bonding apparatus
SHINKAWA KK26 citations92
US6222274B1Apr 24, 2001
Bonding wire loop shape for a semiconductor device
SHINKAWA KK24 citations92
US6080651AJun 27, 2000
Wire bonding method
SHINKAWA KK22 citations92
US6045318AApr 4, 2000
Lead frame supplying method and apparatus
SHINKAWA KK24 citations92
US5989995ANov 23, 1999
Semiconductor device and wire bonding method therefor
SHINKAWA KK40 citations92
US5967401AOct 19, 1999
Wire bonding method
SHINKAWA KK26 citations92
US5961029AOct 5, 1999
Wire bonding method
SHINKAWA KK37 citations92
US5364009ANov 15, 1994
Ultrasonic wire bonding method
SHINKAWA KK26 citations92
US6001670ADec 14, 1999
Lead frame supplying method
SHINKAWA KK7 citations74
US6595400B2Jul 22, 2003
Wire bonding apparatus
SHINKAWA KK8 citations73
US6467678B2Oct 22, 2002
Wire bonding method and apparatus
SHINKAWA KK9 citations73
US6343733B1Feb 5, 2002
Wire bonding method
SHINKAWA KK12 citations73
US6250539B1Jun 26, 2001
Wire bonding method
SHINKAWA KK8 citations73
US6213384B1Apr 10, 2001
Wire bonding method
SHINKAWA KK11 citations73
US5219112AJun 15, 1993
Wire bonding apparatus
SHINKAWA KK9 citations71
US5207370AMay 4, 1993
Wire bonding method and apparatus
SHINKAWA KK11 citations71
US6502738B2Jan 7, 2003
Wire bonding apparatus
SHINKAWA KK4 citations63
US5524811AJun 11, 1996
Wire bonding method
SHINKAWA KK5 citations62
US5485063AJan 16, 1996
Motor control circuit for a wire bonding apparatus
SHINKAWA KK2 citations62
US5386936AFeb 7, 1995
Wire bonding method
SHINKAWA KK3 citations62
US6033932AMar 7, 2000
Lead frame supplying apparatus
SHINKAWA KK1 citations52
US5287064AFeb 15, 1994
Bonding point polarity determining apparatus
SHINKAWA KK0 citations52