Wire bonding method

Abstract

A method for moving a capillary so as to connect wire to a first bonding point and then to a second bonding point in manufacturing, for instance, semiconductor devices, including the steps of moving the capillary in a opposite direction from the second bonding point after moving the capillary away from the first bonding point, and then moving the capillary slightly towards the first bonding point so as to form a firm kink in the wire, and after which the capillary is further moved away from the first bonding point delivering the wire, and then the capillary is moved towards the second bonding point to connect the wire to the second bonding point.

What is claimed is: 
     
       1. A wire bonding method in which a first bonding point and a second bonding point are connected by a wire, and in which a reverse operation which causes a capillary to move in a horizontal direction opposite from said second bonding point during a wire loop formation is performed, wherein said method further comprises lowering said capillary slightly after said reverse operation, and then raising said capillary. 
     
     
       2. A wire bonding method for connecting a first bonding point and a second bonding point by a wire, said method comprising the steps of: connecting said wire to said first bonding point;   performing a first reverse operation in which a capillary is raised and then moved in a direction opposite from said second bonding point;   performing a second reverse operation in which said capillary is raised and then moved in a direction opposite from said second bonding point;   lowering said capillary slightly, and   raising said capillary thus delivering said wire, moving said capillary toward said second bonding point, and connecting said wire to said second bonding point.   
     
     
       3. A wire bonding method for connecting a first bonding point and a second bonding point by a wire which passes through a capillary movable vertically and horizontally, said method comprising the steps of: connecting said wire to said first bonding point;   moving said capillary in a direction away from said first bonding point;   moving said capillary in a direction opposite from said second bonding point;   moving said capillary in a direction away from said first bonding point for a first distance;   moving said capillary in a direction opposite from said second bonding point;   moving said capillary in a direction toward said first bonding point for a second distance which is shorter than said first distance;   moving said capillary in a direction away from said first bonding direction, delivering said wire; and   moving said capillary toward said second bonding point and then connecting said wire to said second bonding point.