Inventor

HEINRICH ALEXANDER

DE74 patents

⚠️ This page may combine multiple inventors who share the name “HEINRICH ALEXANDER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HEINRICH ALEXANDER

INFINEON TECHNOLOGIES AG

Method of forming a chip assembly with a die attach liquid

Chip assembly

Chip assembly

Layer structure with an intermetallic phase layer and a chip package that includes the layer structure

Method of forming a chip package and chip package

Solder material with two different size nickel particles

Multi-purpose non-linear semiconductor package assembly line

Batch process for connecting chips to a carrier

Electronic device with multi-layer contact and system

Method for producing a chip assemblage

Diffusion solder bonding using solder preforms

Semiconductor device and method

Pre-plating of solder layer on solderable elements for diffusion soldering

Flat lead package formation method

Multi-purpose non-linear semiconductor package assembly line

Chip assembly and method of manufacturing thereof

Method of forming an intermetallic phase layer with a plurality of nickel particles

Electronic device with multi-layer contact and system

Soldering a conductor to an aluminum metallization

Soldering a conductor to an aluminum metallization

Soldering a conductor to an aluminum metallization

Semiconductor devices and methods of forming thereof

Semiconductor devices and methods of forming thereof

Semiconductor device and method for fabricating the same

Semiconductor device including a solder compound containing a compound Sn/Sb

SANOFI AVENTIS DEUTSCHLAND

Data collection apparatus for attachment to an injection device

Data collection apparatus for attachment to an injection device

Data collection apparatus for attachment to an injection device

Data collection apparatus for attachment to an injection device

Data collection apparatus for attachment to an injection device

Data collection apparatus for attachment to an injection device

Data collection apparatus for attachment to an injection device

Data collection apparatus for attachment to an injection device

INFINEON TECHNOLOGIES AUSTRIA AG

Inkjet printing of diffusion solder

Semiconductor device and method for fabricating a semiconductor device

Semiconductor device and method for fabricating a semiconductor device

Semiconductor device having a soldered joint with one or more intermetallic phases

Preform diffusion soldering

Semiconductor package and method for fabricating a semiconductor package

HEINRICH ALEXANDER

Electronic device with multi-layer contact

Bonding material with exothermically reactive heterostructures

Backing piece for attaching an electrical component to a housing wall

Method for mounting a semiconductor chip on a carrier

CONTINENTAL AUTOMOTIVE GMBH

Method for controlling a locking element of a vehicle

Method for verifying a predefined maximum spatial distance of a radio key in relation to a motor vehicle, as well as control device, motor vehicle and radio key

NIKITIN IVAN

Semiconductor device and method of manufacturing thereof

Semiconductor device and method

HERMANN STEFAN

Method and apparatus for access and/or starting verification

HESS REINHARD

Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements

SHL MEDICAL AG

Grip for a medical injector