Inventor
LEUTEN TYLER
US13 patents
Patents
13 patentsUS10032707B2Jul 24, 2018
Post-grind die backside power delivery
INTEL CORP12 citations81
US10304799B2May 28, 2019
Land grid array package extension
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US12096566B2Sep 17, 2024
Reciprocal PCB manufacturing process
INTEL CORP0 citations60
US11646253B2May 9, 2023
Ball interconnect structures for surface mount components
INTEL CORP0 citations60
US12237300B2Feb 25, 2025
Through-substrate void filling for an integrated circuit assembly
INTEL CORP0 citations59
US10910301B2Feb 2, 2021
Post-grind die backside power delivery
INTEL CORP0 citations59
US11495547B2Nov 8, 2022
Fiber reinforced stiffener
INTEL CORP0 citations57
US11399434B2Jul 26, 2022
Electronic package and method of forming an electronic package
INTEL CORP1 citations57
US11562978B2Jan 24, 2023
Decoupling capacitor mounted on an integrated circuit die, and method of manufacturing the same
INTEL CORP1 citations54
US11811182B2Nov 7, 2023
Solderless BGA interconnect
INTEL CORP0 citations50
US10872880B2Dec 22, 2020
Land grid array package extension
INTEL CORP0 citations49
US10483198B2Nov 19, 2019
Post-grind die backside power delivery
INTEL CORP0 citations49
US11948917B2Apr 2, 2024
Die over mold stacked semiconductor package
INTEL CORP0 citations48