Inventor
BANG WON BAE
KR29 patents
⚠️ This page may combine multiple inventors who share the name “BANG WON BAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
15 patentsUS9613829B1Apr 4, 2017
Method for fabricating semiconductor package and semiconductor package using the same
AMKOR TECHNOLOGY INC12 citations92
US10049954B2Aug 14, 2018
Semiconductor package having routable encapsulated conductive substrate and method
AMKOR TECHNOLOGY INC7 citations83
US10177117B2Jan 8, 2019
Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure
AMKOR TECHNOLOGY INC3 citations73
US9631481B1Apr 25, 2017
Semiconductor device including leadframe with a combination of leads and lands and method
AMKOR TECHNOLOGY INC4 citations73
US9275939B1Mar 1, 2016
Semiconductor device including leadframe with a combination of leads and lands and method
AMKOR TECHNOLOGY INC4 citations73
US10685897B2Jun 16, 2020
Semiconductor package having routable encapsulated conductive substrate and method
AMKOR TECHNOLOGY INC2 citations72
US10468343B2Nov 5, 2019
Method for fabricating semiconductor package and semiconductor package using the same
AMKOR TECHNOLOGY INC1 citations72
US9881864B2Jan 30, 2018
Method for fabricating semiconductor package and semiconductor package using the same
AMKOR TECHNOLOGY INC3 citations72
US9552999B2Jan 24, 2017
Packaged electronic device having reduced parasitic effects and method
AMKOR TECHNOLOGY INC2 citations72
US9922919B2Mar 20, 2018
Electronic package structure having insulated substrate with lands and conductive patterns
AMKOR TECHNOLOGY INC1 citations63
US10910298B2Feb 2, 2021
Method of forming a molded substrate electronic package and structure
AMKOR TECHNOLOGY INC0 citations62
US9978695B1May 22, 2018
Semiconductor device including leadframe with a combination of leads and lands and method
AMKOR TECHNOLOGY INC1 citations62
US9508631B1Nov 29, 2016
Semiconductor device including leadframe with a combination of leads and lands and method
AMKOR TECHNOLOGY INC2 citations62
US10340213B2Jul 2, 2019
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC0 citations52
US10224218B2Mar 5, 2019
Method for fabricating semiconductor package having a multi-layer encapsulated conductive substrate and structure
AMKOR TECHNOLOGY INC0 citations42
AMKOR TECH SINGAPORE HOLDING PTE LTD
13 patentsUS11508635B2Nov 22, 2022
Semiconductor package having routable encapsulated conductive substrate and method
AMKOR TECH SINGAPORE HOLDING PTE LTD2 citations72
US11145588B2Oct 12, 2021
Method for fabricating semiconductor package and semiconductor package using the same
AMKOR TECH SINGAPORE HOLDING PTE LTD2 citations72
US11495505B2Nov 8, 2022
Semiconductor devices and related methods
AMKOR TECH SINGAPORE HOLDING PTE LTD2 citations71
US12550766B2Feb 10, 2026
Semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US12062588B2Aug 13, 2024
Semiconductor package having routable encapsulated conductive substrate and method
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11961794B2Apr 16, 2024
Method of forming a molded substrate electronic package and structure
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11923280B2Mar 5, 2024
Semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11569163B2Jan 31, 2023
Method for fabricating semiconductor package and semiconductor package using the same
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11114369B2Sep 7, 2021
Semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11646248B2May 9, 2023
Semiconductor device having a lead flank and method of manufacturing a semiconductor device having a lead flank
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations61
US11398455B2Jul 26, 2022
Semiconductor devices and related methods
AMKOR TECH SINGAPORE HOLDING PTE LTD1 citations61
US12581975B2Mar 17, 2026
Semiconductor devices and related methods
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations60
US11961775B2Apr 16, 2024
Semiconductor devices and related methods
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations60