Inventor

CHOU MENG-WEI

TW24 patents

⚠️ This page may combine multiple inventors who share the name “CHOU MENG-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHOU MENG-WEI

TAIWAN SEMICONDUCTOR MFG CO LTD

Integrated circuit package and method

Fan-out package with controllable standoff

Integrated circuit package and method

Fan-out package with cavity substrate

Semiconductor device and method

Semiconductor device including electromagnetic interference (EMI) shielding and method of manufacture

Semiconductor packages and methods of forming same

Fan-out package with cavity substrate

Pillar bumps and process for making same

Fan-out package with controllable standoff

Fan-out package with cavity substrate

Semiconductor packages and methods of forming same

Semiconductor device

Integrated circuit packages with ring-shaped substrates

Fan-out package with controllable standoff

Fan-out package with cavity substrate

Semiconductor device

Semiconductor device including electromagnetic interference (EMI) shielding and method of manufacture

Chip package structure with molding layer and method for forming the same

Semiconductor device

LIN CHENG-CHUNG

Pillar bumps and process for making same

LIU CHUNG-SHI

Preventing UBM oxidation in bump formation processes

CHOU MENG-WEI

Method of forming post passivation interconnects

LIN CHIH WEI

Conductive pillar structure