Inventor
HSIAO YUAN-YANG
TW29 patents
Patents
29 patentsUS11114373B1Sep 7, 2021
Metal-insulator-metal structure
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations86
US12230566B2Feb 18, 2025
Metal-insulator-metal structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations75
US11842959B2Dec 12, 2023
Metal-Insulator-Metal structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11728375B2Aug 15, 2023
Metal-insulator-metal (MIM) capacitor structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11705384B2Jul 18, 2023
Through vias of semiconductor structure and method of forming thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11342408B2May 24, 2022
Metal-insulator-metal structure and methods of fabrication thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11031458B2Jun 8, 2021
Metal-insulator-metal (MIM) capacitor structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10734474B2Aug 4, 2020
Metal-insulator-metal structure and methods of fabrication thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10468478B2Nov 5, 2019
Metal-insulator-metal (MIM) capacitor structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11961880B2Apr 16, 2024
Metal-insulator-metal structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11728262B2Aug 15, 2023
Metal plate corner structure on metal insulator metal
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations71
US12477756B2Nov 18, 2025
Metal-insulator-metal structure and methods of fabrication thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12444674B2Oct 14, 2025
Back-end-of-line passive device structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12266592B2Apr 1, 2025
Through vias of semiconductor structure and method of forming thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11990401B2May 21, 2024
Back-end-of-line passive device structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11923405B2Mar 5, 2024
Metal-insulator-metal structure and methods of fabrication thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11362170B2Jun 14, 2022
Metal-insulator-metal (MIM) capacitor structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12327785B2Jun 10, 2025
High voltage passive device structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12300640B2May 13, 2025
Semiconductor device and method of manufacturing thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12107041B2Oct 1, 2024
Metal plate corner structure on metal insulator metal
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12080753B2Sep 3, 2024
Device structure with a redistribution layer and a buffer layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11728295B2Aug 15, 2023
Semiconductor device and method of manufacturing thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11715756B2Aug 1, 2023
Device structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US12368094B2Jul 22, 2025
Semiconductor structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12575118B2Mar 10, 2026
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US12218186B2Feb 4, 2025
Back-end-of-line passive device structure having common connection to ground
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US12087714B2Sep 10, 2024
Reduction of cracks in passivation layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US12557655B2Feb 17, 2026
Passive device structure stress reduction
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations47
US12417973B2Sep 16, 2025
Semiconductor packaging structure and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations47