Inventor · disambiguated record
Keng Kiat Lau
Also filed as: LAU KENG · LAU KENG KIAT
7 granted patents·1 pending application·73 citations·filing 2000–2024
83Inventor score
Top patents by PatentIndex Score
8 records- 0191US7683461B2Integrated circuit leadless package systemSTATS CHIPPAC LTD·Filed 2006·Granted Mar 23, 2010·31 cites·16 claims
- 0285US7298026B2Large die package and method for the fabrication thereofSTATS CHIPPAC LTD·Filed 2005·Granted Nov 20, 2007·13 cites·16 claims
- 0382US7338841B2Leadframe with encapsulant guide and method for the fabrication thereofSTATS CHIPPAC LTD·Filed 2005·Granted Mar 4, 2008·13 cites·20 claims
- 0474US12380818B1Multi-dimensional printing method and apparatusBracha Partners LLC·Filed 2024·Granted Aug 5, 2025·0 cites·5 claims
- 0567US12020596B2Multi-dimensional printing method and apparatusBracha Partners LLC·Filed 2022·Granted Jun 25, 2024·0 cites·9 claims
- 0667US7947534B2Integrated circuit packaging system including a non-leaded packageSTATS CHIPPAC LTD·Filed 2006·Granted May 24, 2011·3 cites·9 claims
- 0763US6505928B1Methods and apparatus for ink jet printing with forced air dryingDIGITAL PRINTING SYSTEMS LLC·Filed 2000·Granted Jan 14, 2003·13 cites·31 claims
- 0845US2011204501A1Integrated circuit packaging system including non-leaded packagePUNZALAN JEFFREY D·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →