Inventor
MODEN WALTER
US26 patents
⚠️ This page may combine multiple inventors who share the name “MODEN WALTER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
25 patentsUS6310390B1Oct 30, 2001
BGA package and method of fabrication
MICRON TECHNOLOGY INC318 citations99
US6303981B1Oct 16, 2001
Semiconductor package having stacked dice and leadframes and method of fabrication
MICRON TECHNOLOGY INC445 citations99
US6291894B1Sep 18, 2001
Method and apparatus for a semiconductor package for vertical surface mounting
MICRON TECHNOLOGY INC293 citations99
US6329222B1Dec 11, 2001
Interconnect for packaging semiconductor dice and fabricating BGA packages
MICRON TECHNOLOGY INC144 citations98
US6046496AApr 4, 2000
Chip package
MICRON TECHNOLOGY INC169 citations98
US5286679AFeb 15, 1994
Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer
MICRON TECHNOLOGY INC331 citations97
US6917090B2Jul 12, 2005
Chip scale image sensor package
MICRON TECHNOLOGY INC40 citations96
US6552427B2Apr 22, 2003
BGA package and method of fabrication
MICRON TECHNOLOGY INC51 citations96
US6506625B1Jan 14, 2003
Semiconductor package having stacked dice and leadframes and method of fabrication
MICRON TECHNOLOGY INC62 citations96
US7215015B2May 8, 2007
Imaging system
MICRON TECHNOLOGY INC16 citations92
US6858467B2Feb 22, 2005
Method for fabricating semiconductor packages with stacked dice and leadframes
MICRON TECHNOLOGY INC18 citations92
US6589810B1Jul 8, 2003
BGA package and method of fabrication
MICRON TECHNOLOGY INC22 citations92
US6511863B2Jan 28, 2003
Method and apparatus for a semiconductor package for vertical surface mounting
MICRON TECHNOLOGY INC18 citations92
US6179659B1Jan 30, 2001
Electrical contact device and associated method of manufacture
MICRON TECHNOLOGY INC30 citations92
US7065868B2Jun 27, 2006
Methods for installing a circuit device
MICRON TECHNOLOGY INC5 citations74
US6969632B2Nov 29, 2005
Method for fabricating image sensor semiconductor package
MICRON TECHNOLOGY INC9 citations74
US6903465B2Jun 7, 2005
Method and apparatus for a semiconductor package for vertical surface mounting
MICRON TECHNOLOGY INC11 citations74
US6777261B2Aug 17, 2004
Method and apparatus for a semiconductor package for vertical surface mounting
MICRON TECHNOLOGY INC8 citations74
US6681480B1Jan 27, 2004
Method and apparatus for installing a circuit device
MICRON TECHNOLOGY INC6 citations74
US6095822AAug 1, 2000
Component module holder
MICRON TECHNOLOGY INC13 citations74
US6479326B1Nov 12, 2002
Heat sink for microchip application
MICRON TECHNOLOGY INC6 citations73
US6788547B2Sep 7, 2004
Method of making electrical contact device
MICRON TECHNOLOGY INC3 citations63
US6316717B1Nov 13, 2001
Heat sink for microchip application
MICRON TECHNOLOGY INC2 citations62
US7600314B2Oct 13, 2009
Methods for installing a plurality of circuit devices
MICRON TECHNOLOGY INC0 citations52
US6625885B1Sep 30, 2003
Method of making an electrical contact device
MICRON TECHNOLOGY INC0 citations52