Inventor

TOONG TEIK TIONG

MY8 patents

⚠️ This page may combine multiple inventors who share the name “TOONG TEIK TIONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ALTERA CORP

2 patents

US7989942B2Aug 2, 2011

IC package with capacitors disposed on an interposal layer

ALTERA CORP10 citations81

US9601419B1Mar 21, 2017

Stacked leadframe packages

ALTERA CORP4 citations63

ANALOG DEVICES INTERNATIONAL UNLIMITED CO

2 patents

US11083089B1Aug 3, 2021

Integrated device package

ANALOG DEVICES INTERNATIONAL UNLIMITED CO5 citations63

US11189593B2Nov 30, 2021

Integrated device package

ANALOG DEVICES INTERNATIONAL UNLIMITED CO1 citations52

TOONG TEIK TIONG

2 patents

US8525326B2Sep 3, 2013

IC package with capacitors disposed on an interposal layer

TOONG TEIK TIONG3 citations57

US8541263B1Sep 24, 2013

Thermoset molding for on-package decoupling in flip chips

TOONG TEIK TIONG1 citations46

LIM KEN BENG

1 patent

US9054077B2Jun 9, 2015

Package having spaced apart heat sink

LIM KEN BENG2 citations57

LIM CHOOI PEI

1 patent

US8786080B2Jul 22, 2014

Systems including an I/O stack and methods for fabricating such systems

LIM CHOOI PEI2 citations56