Integrated device package

Abstract

A package is disclosed. The package can include a package substrate that has an opening, such as a through hole, extending from a top side to a bottom side opposite the top side of the package substrate. The package can also include a component at least partially disposed in the through hole. The component can be an electrical component. The component can be exposed at a bottom surface of the package. The package can include a bonding material that mechanically couples the component and the package substrate.

What is claimed is: 
     
       1. A package comprising
 a package substrate having a through hole extending from a top side to a bottom side opposite the top side of the package substrate; 
 a component at least partially disposed in the through hole and exposed at a bottom surface of the package, the component has a thickness that is greater than a thickness of the package substrate; and 
 a bonding material that mechanically couples the component and the package substrate. 
 
     
     
       2. The package of  claim 1 , wherein the bonding material comprises a molding material extending between a portion of a side surface of the component and a side wall of the through hole of the package substrate. 
     
     
       3. The package of  claim 2 , wherein the molding material is applied over a top surface of the component and a top surface of an integrated circuit mounted to the package substrate, the top surface of the component being opposite a bottom surface of the component that is exposed at the bottom surface of the package. 
     
     
       4. The package of  claim 1 , wherein the bottom side of the package substrate and a bottom surface of the component at least partially define the bottom surface of the package, wherein the bottom side of the package substrate, the bottom surface of the component, and a bottom surface of the bonding material are coplanar to each other at the bottom surface of the package. 
     
     
       5. The package of  claim 1 , wherein the component comprises an electrical component. 
     
     
       6. The package of  claim 5 , wherein the electrical component includes a terminal exposed on the bottom surface of the package. 
     
     
       7. The package of  claim 5 , wherein the electrical component comprises a passive device, the passive device comprises an inductor. 
     
     
       8. The package of  claim 5 , wherein the electrical component comprises an integrated device package. 
     
     
       9. The package of  claim 5 , wherein the electrical component comprises a heat sink. 
     
     
       10. The package of  claim 1 , further comprising a second component mounted to the top side of the package substrate, wherein the bottom side of the package substrate comprises a pad electrically connected to the second component by way of internal traces in the package substrate. 
     
     
       11. The package of  claim 1 , wherein the package substrate comprises a printed circuit board. 
     
     
       12. A package comprising:
 a package substrate having a top side and a bottom side opposite the top side, the top side of the package substrate comprises a first portion and a second portion, the second portion comprising an opening in the package substrate; 
 an integrated circuit mounted over the first portion of the package substrate; 
 a component disposed in the second portion of the package substrate, a bottom side of the component being below the top side of the package substrate; and 
 a molding compound at least partially disposed over the top side of the package substrate and embedding the integrated circuit and the component, 
 wherein a thickness of the component is greater than a thickness of the integrated circuit and a top side of the component is above the top side of the package substrate. 
 
     
     
       13. The package of  claim 12 , wherein the component comprises an inductor. 
     
     
       14. The package of  claim 12 , wherein the bonding material is in contact with the top side of the package substrate and disposed over the integrated circuit and the component. 
     
     
       15. The package of  claim 12 , wherein the opening comprises a through hole that extends from the top side of the package substrate through the bottom side of the package substrate, wherein the bottom side of the first component, the bottom side of the package substrate, and a bottom side of the bonding material are coplanar at a bottom surface of the package. 
     
     
       16. The package of  claim 12 , wherein the opening comprises a recessed portion that partially extends through the package substrate from the top side of the package substrate. 
     
     
       17. The package of  claim 12  is configured to handle a current range defined by a minimum current value and a maximum current value, the current range including 10 A. 
     
     
       18. A package comprising:
 a package substrate having a top side and a bottom side opposite the top side; 
 an integrated device mounted over the top side of the package substrate; 
 a component having a top side and a bottom side; 
 means for positioning the bottom side of the component below the top side of the package substrate; and 
 a molding compound that mechanically couples the component and the package substrate, the molding compound disposed over the top side of the package substrate and at least partially embedding the component, 
 wherein a thickness of the component is greater than a thickness of the integrated device. 
 
     
     
       19. The package of  claim 18 , wherein the means for positioning comprises a through hole that extends through the package substrate, the component is at least partially disposed in the through hole. 
     
     
       20. The package of  claim 18 , wherein the means for positioning comprises a recessed portion, and the component is mounted on the recessed portion of the package substrate.