Inventor
AN HYEONG-GEUN
KR25 patents
⚠️ This page may combine multiple inventors who share the name “AN HYEONG-GEUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
20 patentsUS7064365B2Jun 20, 2006
Ferroelectric capacitors including a seed conductive film
SAMSUNG ELECTRONICS CO LTD77 citations98
US7800095B2Sep 21, 2010
Phase-change memory device having phase change material pattern shared between adjacent cells and electronic product including the phase-change memory
SAMSUNG ELECTRONICS CO LTD35 citations92
US7638787B2Dec 29, 2009
Phase changeable memory cell array region and method of forming the same
SAMSUNG ELECTRONICS CO LTD36 citations92
US6815226B2Nov 9, 2004
Ferroelectric memory device and method of forming the same
SAMSUNG ELECTRONICS CO LTD16 citations92
US6740531B2May 25, 2004
Method of fabricating integrated circuit devices having dielectric regions protected with multi-layer insulation structures
SAMSUNG ELECTRONICS CO LTD19 citations92
US6717197B2Apr 6, 2004
Ferroelectric memory device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD15 citations92
US6686620B2Feb 3, 2004
FRAM and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD23 citations92
US6664578B2Dec 16, 2003
Ferroelectric memory device and method of forming the same
SAMSUNG ELECTRONICS CO LTD29 citations92
US7824954B2Nov 2, 2010
Methods of forming phase change memory devices having bottom electrodes
SAMSUNG ELECTRONICS CO LTD21 citations91
US7767568B2Aug 3, 2010
Phase change memory device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD17 citations84
US7563639B2Jul 21, 2009
Phase-changeable memory device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD10 citations83
US7309885B2Dec 18, 2007
PRAMs having a plurality of active regions located vertically in sequence and methods of forming the same
SAMSUNG ELECTRONICS CO LTD15 citations82
US6815227B2Nov 9, 2004
Method of fabricating a ferroelectric memory device
SAMSUNG ELECTRONICS CO LTD7 citations74
US7777212B2Aug 17, 2010
Phase change memory devices including carbon-containing adhesive pattern
SAMSUNG ELECTRONICS CO LTD7 citations73
US7023037B2Apr 4, 2006
Integrated circuit devices having dielectric regions protected with multi-layer insulation structures
SAMSUNG ELECTRONICS CO LTD8 citations73
US8039298B2Oct 18, 2011
Phase changeable memory cell array region and method of forming the same
SAMSUNG ELECTRONICS CO LTD2 citations63
US8039829B2Oct 18, 2011
Contact structure, a semiconductor device employing the same, and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD6 citations62
US7638788B2Dec 29, 2009
Phase change memory device and method of forming the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US7479405B2Jan 20, 2009
PRAMS having a plurality of active regions located vertically in sequence and methods of forming the same
SAMSUNG ELECTRONICS CO LTD2 citations60
US8021977B2Sep 20, 2011
Methods of forming contact structures and semiconductor devices fabricated using contact structures
SAMSUNG ELECTRONICS CO LTD0 citations52
AN HYEONG-GEUN
3 patentsUS8625325B2Jan 7, 2014
Memory cells including resistance variable material patterns of different compositions
AN HYEONG-GEUN13 citations82
US8502184B2Aug 6, 2013
Nonvolatile memory device using variable resistive element
AN HYEONG-GEUN10 citations82
US8426840B2Apr 23, 2013
Nonvolatile memory cells having phase changeable patterns therein for data storage
AN HYEONG-GEUN12 citations82