Inventor
BYUN DAE JUNG
KR19 patents
⚠️ This page may combine multiple inventors who share the name “BYUN DAE JUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
16 patentsUS9859222B1Jan 2, 2018
Fan-out semiconductor package
SAMSUNG ELECTRO MECH6 citations73
US10276467B2Apr 30, 2019
Fan-out semiconductor package
SAMSUNG ELECTRO MECH3 citations71
US11183462B2Nov 23, 2021
Substrate having electronic component embedded therein
SAMSUNG ELECTRO MECH2 citations69
US12219692B2Feb 4, 2025
Printed circuit board
SAMSUNG ELECTRO MECH0 citations60
US11864307B2Jan 2, 2024
Printed circuit board
SAMSUNG ELECTRO MECH0 citations60
US11758650B2Sep 12, 2023
Flexible printed circuit board and electronic device including the same
SAMSUNG ELECTRO MECH1 citations60
US11744012B2Aug 29, 2023
Printed circuit board and substrate including electronic component embedded therein
SAMSUNG ELECTRO MECH0 citations60
US11631643B2Apr 18, 2023
Substrate embedded electronic component package
SAMSUNG ELECTRO MECH0 citations60
US11587878B2Feb 21, 2023
Substrate having electronic component embedded therein
SAMSUNG ELECTRO MECH1 citations60
US11251133B2Feb 15, 2022
Substrate having electronic component embedded therein
SAMSUNG ELECTRO MECH0 citations60
US11576254B2Feb 7, 2023
Cable substrate
SAMSUNG ELECTRO MECH0 citations59
US7665206B2Feb 23, 2010
Printed circuit board and manufacturing method thereof
SAMSUNG ELECTRO MECH3 citations58
US11075156B2Jul 27, 2021
Substrate having electronic component embedded therein
SAMSUNG ELECTRO MECH0 citations50
US10157868B2Dec 18, 2018
Fan-out semiconductor package
SAMSUNG ELECTRO MECH0 citations49
US11640952B2May 2, 2023
Electronic component embedded substrate
SAMSUNG ELECTRO MECH0 citations48
US8037584B2Oct 18, 2011
Printed circuit board, method of manufacturing the same, and apparatus for perforating via holes
SAMSUNG ELECTRO MECH1 citations44