Printed circuit board

Abstract

A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.

What is claimed is: 
     
       1. A printed circuit board comprising:
 a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and 
 a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers, 
 wherein a dissipation factor of each adhesive layer of the plurality of first adhesive layers is lower than a dissipation factor of each adhesive layer of the plurality of second adhesive layers, 
 the plurality of first wiring layers excluding a lowermost wiring layer are respectively embedded in the plurality of first adhesive layers such that side surfaces of the plurality of first wiring layers excluding the lowermost wiring layer are respectively covered by the plurality of first adhesive layers, and 
 one of the plurality of second wiring layers is embedded in one of the plurality of second adhesive layers such that side surfaces of the one of the plurality of second wiring layers are covered by the one of the plurality of second adhesive layers. 
 
     
     
       2. The printed circuit board of  claim 1 , wherein a dissipation factor of each insulating layer of the plurality of first insulating layers is lower than a dissipation factor of each insulating layer of the plurality of second insulating layers. 
     
     
       3. The printed circuit board of  claim 2 , wherein a material for forming each insulating layer of the plurality of first insulating layers comprises a liquid crystal polymer. 
     
     
       4. The printed circuit board of  claim 1 , wherein a lowermost second adhesive layer among the plurality of second adhesive layers is disposed between an uppermost first insulating layer among the plurality of first insulating layers and a lowermost second insulating layer among the plurality of second insulation layers, to cover an uppermost first wiring layer among the plurality of first wiring layers. 
     
     
       5. The printed circuit board of  claim 1 , wherein at least one first wiring layer among the plurality of first wiring layers comprises a signal pattern. 
     
     
       6. The printed circuit board of  claim 5 , wherein at least one other first wiring layer among the plurality of first wiring layers comprises a ground pattern,
 wherein the at least one other first wiring layer including the ground pattern is disposed on a different level from the at least one first wiring layer including the signal pattern. 
 
     
     
       7. The printed circuit board of  claim 6 , wherein the at least one other first wiring layer including the ground pattern is disposed on both sides of the at least one first wiring layer including the signal pattern. 
     
     
       8. The printed circuit board of  claim 1 , wherein the plurality of first insulating layers comprise a core layer,
 a portion of the plurality of first wiring layers is disposed on one side of the core layer, and 
 remaining portions of the plurality of first wiring layers are disposed on the other side of the core layer, opposite to the one side of the core layer. 
 
     
     
       9. The printed circuit board of  claim 8 , wherein the second substrate portion is disposed on the one side of the core layer, and
 at least one first wiring layer among the remaining portions of the plurality of first wiring layers disposed on the other side of the core layer comprises a signal pattern. 
 
     
     
       10. A printed circuit board comprising:
 a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and 
 a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers, 
 wherein a dissipation factor of each adhesive layer of the plurality of first adhesive layers is lower than a dissipation factor of each adhesive layer of the plurality of second adhesive layers, 
 the plurality of first insulating layers comprise a core layer, 
 a portion of the plurality of first wiring layers is disposed on one side of the core layer, 
 remaining portions of the plurality of first wiring layers are disposed on the other side of the core layer, opposite to the one side of the core layer, and 
 two of the plurality of first wiring layers are respectively disposed on opposing surfaces of the core layer. 
 
     
     
       11. The printed circuit board of  claim 8 , wherein one of the plurality of first wiring layers is disposed on one surface of the core layer, and another of the plurality of first wiring layers is embedded in the core layer and exposed from another surface of the core layer opposing the one surface. 
     
     
       12. The printed circuit board of  claim 8 , wherein among the plurality of first wiring layers and the plurality of second wiring layers, only one wiring layer of the plurality of first wiring layers is in contact with the core layer. 
     
     
       13. The printed circuit board of  claim 8 , wherein the core layer has a thickness greater than a thickness of each of remaining insulating layers of the plurality of first insulating layers, a thickness of each of the plurality of second insulating layers, a thickness of each of the plurality of first adhesive layers, and a thickness of each of the plurality of second adhesive layers. 
     
     
       14. The printed circuit board of  claim 1 , further comprising a protective layer respectively disposed on the first substrate portion and the second substrate portion, and respectively having an opening exposing at least a portion of an outermost first wiring layer among the plurality of first wiring layers and an opening exposing at least a portion of an outermost second wiring layer among the plurality of second wiring layers. 
     
     
       15. A printed circuit board comprising:
 a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and 
 a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers, 
 wherein a dissipation factor of each insulating layer of the plurality of first insulating layers is lower than a dissipation factor of each insulating layer of the plurality of second insulating layers, 
 the plurality of first wiring layers excluding a lowermost wiring layer are respectively embedded in the plurality of first adhesive layers such that side surfaces of the plurality of first wiring layers excluding the lowermost wiring layer are respectively covered by the plurality of first adhesive layers, and 
 one of the plurality of second wiring layers is embedded in one of the plurality of second adhesive layers such that side surfaces of the one of the plurality of second wiring layers are covered by the one of the plurality of second adhesive layers. 
 
     
     
       16. The printed circuit board of  claim 15 , wherein the first substrate portion is disposed only on one side of the second substrate portion. 
     
     
       17. The printed circuit board of  claim 15 , wherein each of the plurality of first adhesive layers includes a material different from a material included in each of the plurality of first insulating layers. 
     
     
       18. The printed circuit board of  claim 1 , wherein the first substrate portion is disposed only on one side of the second substrate portion. 
     
     
       19. The printed circuit board of  claim 1 , wherein each of the plurality of first adhesive layers includes a material different from a material included in each of the plurality of first insulating layers. 
     
     
       20. The printed circuit board of  claim 15 , wherein the second substrate portion is disposed on the first substrate portion in one direction,
 one of the plurality of first wiring layers protrudes in a direction opposite to the one direction on one of the plurality of first insulating layer to be embedded in one of the plurality of first adhesive layers, and 
 the one of the plurality of second wiring layers protrudes in the one direction on one of the plurality of second insulating layer to be embedded in the one of the plurality of second adhesive layers. 
 
     
     
       21. The printed circuit board of  claim 1 , wherein the second substrate portion is disposed on the first substrate portion in one direction,
 one of the plurality of first wiring layers protrudes in a direction opposite to the one direction on one of the plurality of first insulating layer to be embedded in one of the plurality of first adhesive layers, and 
 the one of the plurality of second wiring layers protrudes in the one direction on one of the plurality of second insulating layer to be embedded in the one of the plurality of second adhesive layers.