Inventor · disambiguated record
Dae Jung Byun
Also filed as: BYUN DAE JUNG
19 granted patents·7 pending applications·24 citations·filing 2007–2025
90Inventor score
Files withSAMSUNG ELECTRO MECH22SAMSUNG ELECTRONICS CO LTD2PARK KWANG SOO1SAMSUNG ELECTRO MACHANICS CO LTD1
Top patents by PatentIndex Score
26 records- 0188US9859222B1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2016·Granted Jan 2, 2018·6 cites·22 claims
- 0286US11587878B2Substrate having electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2022·Granted Feb 21, 2023·1 cites·4 claims
- 0386US10818621B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 27, 2020·5 cites·7 claims
- 0483US11183462B2Substrate having electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2020·Granted Nov 23, 2021·2 cites·20 claims
- 0581US11758650B2Flexible printed circuit board and electronic device including the sameSAMSUNG ELECTRO MECH·Filed 2021·Granted Sep 12, 2023·1 cites·20 claims
- 0677US12219692B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2023·Granted Feb 4, 2025·0 cites·7 claims
- 0777US10276467B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Apr 30, 2019·3 cites·31 claims
- 0874US10515916B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 24, 2019·2 cites·20 claims
- 0974US2023354513A1Printed circuit board and substrate including electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 1069US11744012B2Printed circuit board and substrate including electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2021·Granted Aug 29, 2023·0 cites·19 claims
- 1165US11864307B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2020·Granted Jan 2, 2024·0 cites·21 claims
- 1263US2025344322A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2025·Application pending·0 cites
- 1362US7665206B2Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 23, 2010·3 cites·4 claims
- 1460US11576254B2Cable substrateSAMSUNG ELECTRO MECH·Filed 2021·Granted Feb 7, 2023·0 cites·22 claims
- 1559US11251133B2Substrate having electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2020·Granted Feb 15, 2022·0 cites·16 claims
- 1659US2025063666A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 1753US8037584B2Printed circuit board, method of manufacturing the same, and apparatus for perforating via holesSAMSUNG ELECTRO MECH·Filed 2007·Granted Oct 18, 2011·1 cites·6 claims
- 1852US11631643B2Substrate embedded electronic component packageSAMSUNG ELECTRO MECH·Filed 2020·Granted Apr 18, 2023·0 cites·15 claims
- 1948US11075156B2Substrate having electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2020·Granted Jul 27, 2021·0 cites·19 claims
- 2047US10157868B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Dec 18, 2018·0 cites·11 claims
- 2144US8418356B2Method of manufacturing an embedded printed circuit boardPARK KWANG SOO·Filed 2008·Granted Apr 16, 2013·0 cites·7 claims
- 2244US2022095458A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2020·Application pending·0 cites
- 2343US11640952B2Electronic component embedded substrateSAMSUNG ELECTRO MECH·Filed 2020·Granted May 2, 2023·0 cites·19 claims
- 2437US2011216515A1Electro device embedded printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2534US2011141711A1Electronic component embedded printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2631US2011214913A1Electro device embedded printed circuit board and manufacturng method thereofSAMSUNG ELECTRO MACHANICS CO LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →