Inventor · disambiguated record
Tae Hong Min
Also filed as: MIN TAE HONG
62 granted patents·40 pending applications·681 citations·filing 2002–2024
98Inventor score
Files withSAMSUNG ELECTRO MECH56SAMSUNG ELECTRONICS CO LTD20KANG UN-BYOUNG3CHO YOUNG-SANG2CHOI EUN-KYOUNG2
Top patents by PatentIndex Score
102 records- 0199US10109588B2Electronic component package and package-on-package structure including the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Oct 23, 2018·94 cites·29 claims
- 0297US8802495B2Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 12, 2014·87 cites·21 claims
- 0397US8604615B2Semiconductor device including a stack of semiconductor chips, underfill material and molding materialLEE CHUNG-SUN·Filed 2011·Granted Dec 10, 2013·75 cites·42 claims
- 0496US11894346B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 6, 2024·2 cites·20 claims
- 0596US9543276B2Chip-stacked semiconductor packageJEE YOUNG-KUN·Filed 2015·Granted Jan 10, 2017·55 cites·13 claims
- 0696US8816407B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 26, 2014·90 cites·20 claims
- 0795US11018115B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 25, 2021·3 cites·19 claims
- 0895US10153255B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 11, 2018·12 cites·19 claims
- 0995US9899136B2Coil component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Feb 20, 2018·11 cites·29 claims
- 1095US8759147B2Semiconductor packages and methods of fabricating the sameCHOI EUN-KYOUNG·Filed 2011·Granted Jun 24, 2014·57 cites·18 claims
- 1194US11437724B2Antenna moduleSAMSUNG ELECTRO MECH·Filed 2020·Granted Sep 6, 2022·3 cites·19 claims
- 1294US8791562B2Stack package and semiconductor package including the sameLEE CHUNG-SUN·Filed 2011·Granted Jul 29, 2014·34 cites·17 claims
- 1393US10930613B2Semiconductor package having recessed adhesive layer between stacked chipsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 23, 2021·9 cites·17 claims
- 1492US8884416B2Semiconductor apparatus having through vias configured to isolate power supplied to a memory chip from data signals supplied to the memory chipLEE GO EUN·Filed 2010·Granted Nov 11, 2014·51 cites·26 claims
- 1592US8450856B2Semiconductor device and method of forming the sameKANG UN-BYOUNG·Filed 2011·Granted May 28, 2013·18 cites·14 claims
- 1690US10622335B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 14, 2020·4 cites·20 claims
- 1789US11122694B2Printed circuit board and package having the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Sep 14, 2021·5 cites·14 claims
- 1888US10362667B2Circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 23, 2019·4 cites·4 claims
- 1986US12183718B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Dec 31, 2024·0 cites·20 claims
- 2086US11664352B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 30, 2023·1 cites·20 claims
- 2184US10497675B2Semiconductor device including multiple semiconductor chipsKWAK BYOUNG SOO·Filed 2016·Granted Dec 3, 2019·7 cites·14 claims
- 2284US8492902B2Multi-layer TSV insulation and methods of fabricating the sameLEE HO-JIN·Filed 2011·Granted Jul 23, 2013·8 cites·14 claims
- 2382US9721926B2Semiconductor device having stacked semiconductor chips interconnected via TSV and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 1, 2017·4 cites·27 claims
- 2480US11394104B2Printed circuit board and antenna module comprising the sameSAMSUNG ELECTRO MECH·Filed 2020·Granted Jul 19, 2022·1 cites·20 claims
- 2580US11272613B2Printed circuit board and package including printed circuit boardSAMSUNG ELECTRO MECH·Filed 2019·Granted Mar 8, 2022·2 cites·39 claims
- 2679US9832856B2Circuit boardSAMSUNG ELECTRO MECH·Filed 2016·Granted Nov 28, 2017·3 cites·8 claims
- 2779US9099541B2Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 4, 2015·4 cites·8 claims
- 2878US8633579B2Multi-chip package and method of manufacturing the sameKANG UN-BYOUNG·Filed 2011·Granted Jan 21, 2014·4 cites·14 claims
- 2977US12219692B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2023·Granted Feb 4, 2025·0 cites·7 claims
- 3077US9655229B2Circuit boardSAMSUNG ELECTRO MECH·Filed 2015·Granted May 16, 2017·2 cites·18 claims
- 3176US8884421B2Multi-chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 11, 2014·3 cites·10 claims
- 3274US8854489B2Image processing method and image processing apparatusJANG SOON-GEUN·Filed 2011·Granted Oct 7, 2014·4 cites·23 claims
- 3373US9699885B2Circuit board including heat dissipation structureSAMSUNG ELECTRO MECH·Filed 2015·Granted Jul 4, 2017·2 cites·17 claims
- 3473US9324683B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 26, 2016·3 cites·12 claims
- 3573US9059072B2Semiconductor packages and methods of fabricating the sameCHOI EUN-KYOUNG·Filed 2014·Granted Jun 16, 2015·3 cites·4 claims
- 3671US12309924B2Connection structure embedded substrate and substrate structure including the sameSAMSUNG ELECTRO MECH·Filed 2023·Granted May 20, 2025·0 cites·20 claims
- 3771US10651154B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 12, 2020·1 cites·20 claims
- 3869US10020290B2Semiconductor device having stacked semiconductor chips interconnected via TSVCHOE YEONG HWAN·Filed 2017·Granted Jul 10, 2018·2 cites·20 claims
- 3969US9945911B2Apparatus and method for measuring impedance for fuel cell diagnosisHYUNDAI AUTRON CO LTD·Filed 2015·Granted Apr 17, 2018·1 cites·9 claims
- 4069US8373767B2Digital photographing apparatus, method of controlling the digital photographing apparatus, and recording medium storing program to implement the methodSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Feb 12, 2013·2 cites·20 claims
- 4168US11769622B2Inductor device and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Sep 26, 2023·0 cites·26 claims
- 4267US10212803B2Circuit board and circuit board assemblySAMSUNG ELECTRO MECH·Filed 2016·Granted Feb 19, 2019·1 cites·23 claims
- 4367US9589947B2Semiconductor packages and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 7, 2017·1 cites·16 claims
- 4465US11864307B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2020·Granted Jan 2, 2024·0 cites·21 claims
- 4564US10064291B2Circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2015·Granted Aug 28, 2018·1 cites·8 claims
- 4663US12262467B2Printed circuit board including an insulating layer and a metal postSAMSUNG ELECTRO MECH·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 4762US11445598B2Printed circuit board and antenna module comprising the sameSAMSUNG ELECTRO MECH·Filed 2020·Granted Sep 13, 2022·0 cites·18 claims
- 4862US7015313B2Lectin protein prepared from Korean marine crab Philyra pisum, process for preparing the same and the use thereofKIM HA-HYUNG·Filed 2002·Granted Mar 21, 2006·2 cites·11 claims
- 4962US2025176099A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 5061US11737211B2Connection structure embedded substrate and substrate structure including the sameSAMSUNG ELECTRO MECH·Filed 2021·Granted Aug 22, 2023·0 cites·14 claims
Showing the top 50 of 102 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →