Inventor

HOSODA NAOHIRO

JP24 patents

⚠️ This page may combine multiple inventors who share the name “HOSODA NAOHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HOSODA NAOHIRO

SANDISK TECHNOLOGIES LLC

Bonded structure including a performance-optimized support chip and a stress-optimized three-dimensional memory chip and method for making the same

Three-dimensional memory device including stepped connection plates and methods of forming the same

Three-dimensional memory device containing structurally reinforced pedestal channel portions and method of making thereof

Three-dimensional memory device with electrically isolated support pillar structures and method of making thereof

Three-dimensional memory device with gated contact via structures and method of making thereof

Method for etching bottom punch-through opening in a memory film of a multi-tier three-dimensional memory device

Bonded structure including a performance-optimized support chip and a stress-optimized three-dimensional memory chip and method for making the same

Memory die with source side of three-dimensional memory array bonded to logic die and methods of making the same

Memory die with source side of three-dimensional memory array bonded to logic die and methods of making the same

Three-dimensional memory device containing amorphous and crystalline blocking dielectric layers

Three-dimensional memory device containing amorphous and crystalline blocking dielectric layers

Three-dimensional memory device containing multi-threshold-voltage drain select gates and method of making the same

Three-dimensional memory device including a drain contact etch-stop dielectric layer and methods for forming the same

X-direction divided sub-block mode in NAND

Three-dimensional memory device including a mid-stack source layer and methods for forming the same

RENESAS TECH CORP

Method of manufacturing a nonvolatile semiconductor memory device

Semiconductor device and a method for manufacturing the same

Method of manufacturing a trench isolation region in a semiconductor device

SANDISK TECHNOLOGIES INC

Three-dimensional memory device containing plural metal oxide blocking dielectric layers and method of making thereof

Sub-block separation in NAND memory through word line based selectors

Sub-block separation in NAND memory through word line based selectors

HOSODA NAOHIRO

Semiconductor device and manufacturing method of semiconductor device

Water-soluble film roll and method for paying out water-soluble film

RENESAS ELECTRONICS CORP

Semiconductor device and manufacturing method of semiconductor device