Inventor

HUANG YU-LUNG

TW41 patents

⚠️ This page may combine multiple inventors who share the name “HUANG YU-LUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG YU-LUNG

XINTEC INC

Chip package and fabrication method thereof

Stacked chip package and method for forming the same

Chip package and method for forming the same

Chip scale sensing chip package and a manufacturing method thereof

Chip package and method for fabricating the same

Sensing module and method for forming the same

Chip package and method for forming the same

Semiconductor chip package and method for manufacturing thereof

Chip package and manufacturing method thereof

Chip package and method for forming the same

Chip package

Chip package

Chip package and method for forming the same

Chip package including recess in side edge

Chip package and method for forming the same

Chip package and method for forming the same

Chip package and method for forming the same

Chip package and method for forming the same

Wafer-level packaging sensing device and method for forming the same

SILICONWARE PRECISION INDUSTRIES CO LTD

Electronic package and fabrication method thereof

Electronic package carrier structure thereof, and method for fabricating the carrier structure

Electronic package and manufacturing method thereof

Electronic package and manufacturing method thereof

Electronic package and fabrication method thereof

Electronic package and fabrication method thereof

Electronic package, heat dissipation structure and manufacturing method thereof

Electronic package and fabrication method thereof

Electronic package and manufacturing method thereof

Method for fabricating carrier structure

Flip-chip process and bonding equipment

Electronic package and manufacturing method thereof

Electronic package, manufacturing method thereof and conductive structure

Electronic package, method for fabricating the same, and heat dissipator

Electronic package

Electronic package and manufacturing method thereof

Ultrasonic device

HUANG YU-LUNG

Chip package and fabrication method thereof

Image sensor chip package and method for forming the same

Chip package and method for forming the same

YEN YU-LIN

Chip package and manufacturing method thereof

Chip package