Inventor

SORIMACHI HARUO

JP12 patents

⚠️ This page may combine multiple inventors who share the name “SORIMACHI HARUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHINKO ELECTRIC IND CO

7 patents

US7342248B2Mar 11, 2008

Semiconductor device and interposer

SHINKO ELECTRIC IND CO11 citations83

US6951811B2Oct 4, 2005

Method of producing vias and other conductor parts on an electrode terminal forming surface of a semiconductor wafer

SHINKO ELECTRIC IND CO19 citations83

US6791186B2Sep 14, 2004

Mounting substrate and structure having semiconductor element mounted on substrate

SHINKO ELECTRIC IND CO16 citations83

US10153177B2Dec 11, 2018

Wiring substrate and semiconductor device

SHINKO ELECTRIC IND CO5 citations72

US10516090B2Dec 24, 2019

Backing member

SHINKO ELECTRIC IND CO1 citations61

US8355262B2Jan 15, 2013

Electronic component built-in substrate and method of manufacturing electronic component built-in substrate

SHINKO ELECTRIC IND CO4 citations61

US9087781B2Jul 21, 2015

Semiconductor device and method of manufacturing the same

SHINKO ELECTRIC IND CO0 citations40

FUJITSU LTD

5 patents

US5592735AJan 14, 1997

Method of making a multi-chip module having an improved heat dissipation efficiency

FUJITSU LTD48 citations95

US5432675AJul 11, 1995

Multi-chip module having thermal contacts

FUJITSU LTD63 citations94

US4595823AJun 17, 1986

Thermal printing head with an anti-abrasion layer and method of fabricating the same

FUJITSU LTD15 citations73

US4689638AAug 25, 1987

Thermal recording head and process for manufacturing wiring substrate therefor

FUJITSU LTD11 citations71

US4446355AMay 1, 1984

Crossover construction of thermal-head and method of manufacturing same

FUJITSU LTD11 citations70