Inventor

VIEHBECK ALFRED

US75 patents

⚠️ This page may combine multiple inventors who share the name “VIEHBECK ALFRED”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

VIEHBECK ALFRED

IBM

Methods of fabrication of coaxial vias and magnetic devices

Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier

Coaxial vias in an electronic substrate

System for applying microware energy in processing sheet like materials

High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layer

Method for providing discharge protection or shielding

Composite comprising a metal substrate and a corrosion protecting layer

Electronic package comprising a substrate and a semiconductor device bonded thereto

Composition containing a polymer and conductive filler and use thereof

Prepreg and cured laminate fabricated from a toughened polycyanurate

Toughened polycyanurate resins containing particulates

Multilayer article having a planarized outer layer comprising a toughened polycyanurate

Three dimensional package and architecture for high performance computer

Method for conditioning a substrate for subsequent electroless metal deposition

Method for conditioning halogenated polymeric materials and structures fabricated therewith

Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier

Three dimensional package and architecture for high performance computer

Method for conditioning halogenated polymeric materials and structures fabricated therewith

Fluorinated carbon polymer composites

Fluorinated carbon polymer composites

Patterned deposition of metals via photochemical decomposition of metal-oxalate complexes

Photovoltaic array for computer display

Low dielectric constant fluorinated polymers and methods of fabrication thereof

Three dimensional package and architecture for high performance computer

Applicator to provide uniform electric and magnetic fields over a large area and for continuous processing

Composition containing a polymer and conductive filler and use thereof

Housing for electromagnetic interference shielding

Method for providing discharge protection or shielding

Fluid jet impregnating and coating device with thickness control capability

Method for providing a selective reference layer isolation technique for the production of printed circuit boards

Fluid jet impregnation

Method for conditioning halogenated polymeric materials and structures fabricated therewith

Expandable fluid treatment device for tublar surface treatments

Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier

Fluorinated carbon polymer composites

Fluorinated carbon polymer composites

Isoimide modifications of a polyimide and reaction thereof with nucleophiles

Surface midification of a polyimide

Multilayer structures of different electroactive materials and methods of fabrication thereof

Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin

Multi-level circuit card structure

Conditioning of a substrate for electroless plating thereon

Method for conditioning an organic polymeric material

Method for forming a thin film layer

Microwave applicator having a mechanical means for tuning

Method and apparatus for stressing, burning in and reducing leakage current of electronic devices using microwave radiation

Continuous lamination of electronic structures

Modified dicyanate ester resins having enhanced fracture toughness

Three dimensional package and architecture for high performance computer

3M INNOVATIVE PROPERTIES CO

Photoimageable, aqueous acid soluble polyimide polymers