Inventor
LIN YU-HSIEN
TW61 patents
⚠️ This page may combine multiple inventors who share the name “LIN YU-HSIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
23 patentsUS10325912B2Jun 18, 2019
Semiconductor structure cutting process and structures formed thereby
TAIWAN SEMICONDUCTOR MFG CO LTD19 citations94
US11502076B2Nov 15, 2022
Semiconductor structure cutting process and structures formed thereby
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations85
US11456182B1Sep 27, 2022
Integrated circuit structure and fabrication thereof
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations85
US11114549B2Sep 7, 2021
Semiconductor structure cutting process and structures formed thereby
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations85
US9799567B2Oct 24, 2017
Method of forming source/drain contact
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations83
US10163720B2Dec 25, 2018
Method of forming source/drain contact
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US12132050B2Oct 29, 2024
Semiconductor structure cutting process and structures formed thereby
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12020987B2Jun 25, 2024
Integrated circuit structure and fabrication thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11894370B2Feb 6, 2024
Semiconductor structure cutting process and structures formed thereby
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11387105B2Jul 12, 2022
Loading effect reduction through multiple coat-etch processes
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12490487B2Dec 2, 2025
Tunable structure profile
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12302596B2May 13, 2025
Fin field-effect transistor and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11942532B2Mar 26, 2024
Fin field-effect transistor and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11955547B2Apr 9, 2024
Semiconductor device including an epitaxy region
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12426229B2Sep 23, 2025
Multipatterning gate processing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations57
US12532529B2Jan 20, 2026
Semiconductor devices and methods of manufacturing thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations55
US9996011B2Jun 12, 2018
System and method for lithography alignment
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10755936B2Aug 25, 2020
Loading effect reduction through multiple coat-etch processes
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10522413B2Dec 31, 2019
Method of forming source/drain contact
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10276392B2Apr 30, 2019
Loading effect reduction through multiple coat-etch processes
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9711604B1Jul 18, 2017
Loading effect reduction through multiple coat-etch processes
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12532499B2Jan 20, 2026
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10164093B2Dec 25, 2018
Semiconductor device including an epitaxy region
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
DELTA ELECTRONICS INC
7 patentsUS7352577B2Apr 1, 2008
Liquid-cooled heat dissipation module
DELTA ELECTRONICS INC11 citations84
US12241698B2Mar 4, 2025
Connecting device of liquid cooling module
DELTA ELECTRONICS INC2 citations75
US11297734B2Apr 5, 2022
Heat dissipation module for optical transceiver
DELTA ELECTRONICS INC4 citations73
US7292438B2Nov 6, 2007
Liquid-cooling heat dissipation module
DELTA ELECTRONICS INC9 citations73
US11473486B2Oct 18, 2022
Fluid connector assembly, liquid cooling system and fluid circulation system
DELTA ELECTRONICS INC2 citations69
US9847273B2Dec 19, 2017
Heat sink assembly and clip thereof
DELTA ELECTRONICS INC1 citations52
US8051899B2Nov 8, 2011
Heat dissipating module and heat sink thereof
DELTA ELECTRONICS INC1 citations52
TAIWAN SEMICONDUCTOR MFG
5 patentsUS9304403B2Apr 5, 2016
System and method for lithography alignment
TAIWAN SEMICONDUCTOR MFG64 citations98
US9111906B2Aug 18, 2015
Method for fabricating semiconductor device having spacer elements
TAIWAN SEMICONDUCTOR MFG7 citations83
US8658483B2Feb 25, 2014
Method of fabricating an integrated circuit device having backside bevel protection
TAIWAN SEMICONDUCTOR MFG6 citations80
US9153655B2Oct 6, 2015
Spacer elements for semiconductor device
TAIWAN SEMICONDUCTOR MFG2 citations62
US8735988B2May 27, 2014
Semiconductor device having a first spacer element and an adjacent second spacer element
TAIWAN SEMICONDUCTOR MFG1 citations62
UNITED MICROELECTRONICS CORP
5 patentsUS7067365B1Jun 27, 2006
High-voltage metal-oxide-semiconductor devices and method of making the same
UNITED MICROELECTRONICS CORP24 citations92
US7061029B1Jun 13, 2006
High-voltage device structure
UNITED MICROELECTRONICS CORP18 citations84
US6897116B2May 24, 2005
Method and structure to improve the gate coupling ratio (GCR) for manufacturing a flash memory device
UNITED MICROELECTRONICS CORP14 citations81
US7385274B2Jun 10, 2008
High-voltage metal-oxide-semiconductor devices and method of making the same
UNITED MICROELECTRONICS CORP7 citations74
US7763928B2Jul 27, 2010
Multi-time programmable memory
UNITED MICROELECTRONICS CORP4 citations56
LIN YUN JING
1 patentLIN YU-HSIEN
1 patentFAN WEI-HAN
1 patentHSU JUNG-TZU
1 patentFUTAIJING PREC ELECTRONICS YANTAI CO LTD
1 patentHUANG CHUN-HUNG
1 patentPRIMAX ELECTRONICS LTD
1 patentHARBINGER TECH CORPORATION
1 patentDO NOT USE—TAIWAN SEMICONDUCTOR MFG CO LTD
1 patentHSU WEN-KUANG
1 patentShowing the top 50 of 61 patents by PatentIndex Score.