Inventor
HONDA KAZUTAKA
JP31 patents
⚠️ This page may combine multiple inventors who share the name “HONDA KAZUTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DENSO CORP
15 patentsUS9958505B2May 1, 2018
Voltage sensing circuit and battery pack monitoring system
DENSO CORP8 citations83
US10250206B2Apr 2, 2019
Voltage detection circuit
DENSO CORP2 citations72
US8890565B2Nov 18, 2014
Logic signal transmission circuit with isolation barrier
DENSO CORP6 citations72
US9465083B2Oct 11, 2016
Voltage detecting device for assembled battery
DENSO CORP3 citations66
US12379425B2Aug 5, 2025
Battery monitoring device
DENSO CORP1 citations62
US10429447B2Oct 1, 2019
Voltage sensing device
DENSO CORP1 citations62
US11892514B2Feb 6, 2024
Battery monitoring system
DENSO CORP1 citations60
US10274544B2Apr 30, 2019
Route switching circuit and voltage detection device
DENSO CORP1 citations60
US9678166B2Jun 13, 2017
Voltage detection device
DENSO CORP2 citations57
US11070226B2Jul 20, 2021
A/D conversion device
DENSO CORP0 citations52
US10156613B2Dec 18, 2018
Voltage detection device
DENSO CORP1 citations51
US12270862B2Apr 8, 2025
Battery monitor system
DENSO CORP0 citations49
US11181937B2Nov 23, 2021
Correction current output circuit and reference voltage circuit with correction function
DENSO CORP0 citations49
US10094883B2Oct 9, 2018
Voltage detecting device and battery pack monitoring system
DENSO CORP1 citations48
US10605836B2Mar 31, 2020
Voltage detection device
DENSO CORP0 citations41
HITACHI CHEMICAL CO LTD
8 patentsUS10734350B2Aug 4, 2020
Method for manufacturing semiconductor device
HITACHI CHEMICAL CO LTD1 citations60
US11608455B2Mar 21, 2023
Adhesive for semiconductor device, and high productivity method for manufacturing said device
HITACHI CHEMICAL CO LTD1 citations59
US10669454B2Jun 2, 2020
Method for manufacturing semiconductor device including heating and pressuring a laminate having an adhesive layer
HITACHI CHEMICAL CO LTD1 citations59
US9803111B2Oct 31, 2017
Adhesive for semiconductor, fluxing agent, manufacturing method for semiconductor device, and semiconductor device
HITACHI CHEMICAL CO LTD0 citations52
US9425120B2Aug 23, 2016
Semiconductor device and production method therefor
HITACHI CHEMICAL CO LTD0 citations52
US9129898B2Sep 8, 2015
Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device
HITACHI CHEMICAL CO LTD1 citations52
US9123734B2Sep 1, 2015
Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device
HITACHI CHEMICAL CO LTD0 citations52
US10224311B2Mar 5, 2019
Semiconductor adhesive, and semiconductor device and method for manufacturing same
HITACHI CHEMICAL CO LTD0 citations49
HONDA KAZUTAKA
3 patentsUS8324968B2Dec 4, 2012
Amplifier circuit, signal processor circuit, and semiconductor integrated circuit device
HONDA KAZUTAKA6 citations70
US9024455B2May 5, 2015
Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device
HONDA KAZUTAKA1 citations50
US8674502B2Mar 18, 2014
Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device
HONDA KAZUTAKA0 citations50
SEMICONDUCTOR TECH ACAD RES CT
2 patentsUS7612700B2Nov 3, 2009
Pipeline type A/D converter apparatus provided with precharge circuit for precharging sampling capacitor
SEMICONDUCTOR TECH ACAD RES CT35 citations92
US7898449B2Mar 1, 2011
Differential operational amplifier circuit correcting settling error for use in pipelined A/D converter
SEMICONDUCTOR TECH ACAD RES CT6 citations62