P

Inventor

WANG YING-CHIAO

TW36 patents
⚠️ This page may combine multiple inventors who share the name “WANG YING-CHIAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

34 patents
US10074656B1Sep 11, 2018

Semiconductor memory device and manufacturing method thereof

UNITED MICROELECTRONICS CORP19 citations93
US10068907B1Sep 4, 2018

Dynamic random access memory

UNITED MICROELECTRONICS CORP10 citations84
US9960167B1May 1, 2018

Method for forming semiconductor device

UNITED MICROELECTRONICS CORP7 citations84
US9929162B1Mar 27, 2018

Semiconductor device and method for forming the same

UNITED MICROELECTRONICS CORP9 citations84
US10170481B2Jan 1, 2019

Semiconductor memory device and method of forming the same

UNITED MICROELECTRONICS CORP2 citations73
US9773887B2Sep 26, 2017

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP3 citations73
US9659873B2May 23, 2017

Semiconductor structure with aligning mark and method of forming the same

UNITED MICROELECTRONICS CORP2 citations73
US11508614B2Nov 22, 2022

Method of forming semiconductor device having capped air gaps between buried bit lines and buried gate

UNITED MICROELECTRONICS CORP2 citations72
US10854676B2Dec 1, 2020

Semiconductor device having capped air caps between buried bit lines and buried gate

UNITED MICROELECTRONICS CORP4 citations72
US10672864B2Jun 2, 2020

Manufacturing method of semiconductor memory device

UNITED MICROELECTRONICS CORP2 citations72
US10361209B2Jul 23, 2019

Semiconductor memory device

UNITED MICROELECTRONICS CORP4 citations72
US10276650B2Apr 30, 2019

Semiconductor memory device and manufacturing method thereof

UNITED MICROELECTRONICS CORP2 citations72
US10181473B2Jan 15, 2019

Semiconductor device

UNITED MICROELECTRONICS CORP4 citations72
US9679901B1Jun 13, 2017

Semiconductor device and manufacturing method thereof

UNITED MICROELECTRONICS CORP6 citations72
US11049863B2Jun 29, 2021

Semiconductor structure with capacitor landing pad and method of making the same

UNITED MICROELECTRONICS CORP3 citations71
US10169521B2Jan 1, 2019

Method for forming contact plug layout

UNITED MICROELECTRONICS CORP3 citations69
US11018006B2May 25, 2021

Method for patterning a semiconductor structure

UNITED MICROELECTRONICS CORP0 citations62
US10490557B2Nov 26, 2019

Semiconductor structure with contact plug and method of fabricating the same

UNITED MICROELECTRONICS CORP1 citations62
US11877433B2Jan 16, 2024

Storage node contact structure of a memory device

UNITED MICROELECTRONICS CORP0 citations61
US11765881B2Sep 19, 2023

Semiconductor structure with capacitor landing pad and method of making the same

UNITED MICROELECTRONICS CORP0 citations61
US11563012B2Jan 24, 2023

Semiconductor structure with capacitor landing pad and method of making the same

UNITED MICROELECTRONICS CORP0 citations61
US10763260B2Sep 1, 2020

Semiconductor device and method of manufacturing a semiconductor device

UNITED MICROELECTRONICS CORP0 citations52
US10670958B2Jun 2, 2020

Method for forming a layout pattern

UNITED MICROELECTRONICS CORP0 citations52
US10665594B2May 26, 2020

Semiconductor memory device including gate structure

UNITED MICROELECTRONICS CORP0 citations52
US10553591B2Feb 4, 2020

Semiconductor memory device

UNITED MICROELECTRONICS CORP0 citations52
US10475648B1Nov 12, 2019

Method for patterning a semiconductor structure

UNITED MICROELECTRONICS CORP0 citations52
US10276577B2Apr 30, 2019

Semiconductor memory device and manufacturing method thereof

UNITED MICROELECTRONICS CORP0 citations52
US10236294B2Mar 19, 2019

Method of manufacturing a semiconductor device

UNITED MICROELECTRONICS CORP0 citations52
US10103150B1Oct 16, 2018

Semiconductor device having insulating layer higher than a top surface of the substrate, and method for reducing the difficulty of filling an insulating layer in a recess

UNITED MICROELECTRONICS CORP0 citations52
US9960123B2May 1, 2018

Method of forming semiconductor structure with aligning mark in dicing region

UNITED MICROELECTRONICS CORP1 citations52
US9773790B1Sep 26, 2017

Semiconductor device and method for forming the same

UNITED MICROELECTRONICS CORP0 citations52
US10756090B2Aug 25, 2020

Storage node contact structure of a memory device and manufacturing methods thereof

UNITED MICROELECTRONICS CORP0 citations51
US10204914B2Feb 12, 2019

Method for fabricating semiconductor device

UNITED MICROELECTRONICS CORP0 citations51
US10249510B1Apr 2, 2019

Etching method

UNITED MICROELECTRONICS CORP0 citations42

UNIV NAT TAIWAN

1 patent

APPLIED MATERIALS INC

1 patent