Inventor
WANG YING-CHIAO
TW36 patents
⚠️ This page may combine multiple inventors who share the name “WANG YING-CHIAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
34 patentsUS10074656B1Sep 11, 2018
Semiconductor memory device and manufacturing method thereof
UNITED MICROELECTRONICS CORP19 citations93
US10068907B1Sep 4, 2018
Dynamic random access memory
UNITED MICROELECTRONICS CORP10 citations84
US9960167B1May 1, 2018
Method for forming semiconductor device
UNITED MICROELECTRONICS CORP7 citations84
US9929162B1Mar 27, 2018
Semiconductor device and method for forming the same
UNITED MICROELECTRONICS CORP9 citations84
US10170481B2Jan 1, 2019
Semiconductor memory device and method of forming the same
UNITED MICROELECTRONICS CORP2 citations73
US9773887B2Sep 26, 2017
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP3 citations73
US9659873B2May 23, 2017
Semiconductor structure with aligning mark and method of forming the same
UNITED MICROELECTRONICS CORP2 citations73
US11508614B2Nov 22, 2022
Method of forming semiconductor device having capped air gaps between buried bit lines and buried gate
UNITED MICROELECTRONICS CORP2 citations72
US10854676B2Dec 1, 2020
Semiconductor device having capped air caps between buried bit lines and buried gate
UNITED MICROELECTRONICS CORP4 citations72
US10672864B2Jun 2, 2020
Manufacturing method of semiconductor memory device
UNITED MICROELECTRONICS CORP2 citations72
US10361209B2Jul 23, 2019
Semiconductor memory device
UNITED MICROELECTRONICS CORP4 citations72
US10276650B2Apr 30, 2019
Semiconductor memory device and manufacturing method thereof
UNITED MICROELECTRONICS CORP2 citations72
US10181473B2Jan 15, 2019
Semiconductor device
UNITED MICROELECTRONICS CORP4 citations72
US9679901B1Jun 13, 2017
Semiconductor device and manufacturing method thereof
UNITED MICROELECTRONICS CORP6 citations72
US11049863B2Jun 29, 2021
Semiconductor structure with capacitor landing pad and method of making the same
UNITED MICROELECTRONICS CORP3 citations71
US10169521B2Jan 1, 2019
Method for forming contact plug layout
UNITED MICROELECTRONICS CORP3 citations69
US11018006B2May 25, 2021
Method for patterning a semiconductor structure
UNITED MICROELECTRONICS CORP0 citations62
US10490557B2Nov 26, 2019
Semiconductor structure with contact plug and method of fabricating the same
UNITED MICROELECTRONICS CORP1 citations62
US11877433B2Jan 16, 2024
Storage node contact structure of a memory device
UNITED MICROELECTRONICS CORP0 citations61
US11765881B2Sep 19, 2023
Semiconductor structure with capacitor landing pad and method of making the same
UNITED MICROELECTRONICS CORP0 citations61
US11563012B2Jan 24, 2023
Semiconductor structure with capacitor landing pad and method of making the same
UNITED MICROELECTRONICS CORP0 citations61
US10763260B2Sep 1, 2020
Semiconductor device and method of manufacturing a semiconductor device
UNITED MICROELECTRONICS CORP0 citations52
US10670958B2Jun 2, 2020
Method for forming a layout pattern
UNITED MICROELECTRONICS CORP0 citations52
US10665594B2May 26, 2020
Semiconductor memory device including gate structure
UNITED MICROELECTRONICS CORP0 citations52
US10553591B2Feb 4, 2020
Semiconductor memory device
UNITED MICROELECTRONICS CORP0 citations52
US10475648B1Nov 12, 2019
Method for patterning a semiconductor structure
UNITED MICROELECTRONICS CORP0 citations52
US10276577B2Apr 30, 2019
Semiconductor memory device and manufacturing method thereof
UNITED MICROELECTRONICS CORP0 citations52
US10236294B2Mar 19, 2019
Method of manufacturing a semiconductor device
UNITED MICROELECTRONICS CORP0 citations52
US10103150B1Oct 16, 2018
Semiconductor device having insulating layer higher than a top surface of the substrate, and method for reducing the difficulty of filling an insulating layer in a recess
UNITED MICROELECTRONICS CORP0 citations52
US9960123B2May 1, 2018
Method of forming semiconductor structure with aligning mark in dicing region
UNITED MICROELECTRONICS CORP1 citations52
US9773790B1Sep 26, 2017
Semiconductor device and method for forming the same
UNITED MICROELECTRONICS CORP0 citations52
US10756090B2Aug 25, 2020
Storage node contact structure of a memory device and manufacturing methods thereof
UNITED MICROELECTRONICS CORP0 citations51
US10204914B2Feb 12, 2019
Method for fabricating semiconductor device
UNITED MICROELECTRONICS CORP0 citations51
US10249510B1Apr 2, 2019
Etching method
UNITED MICROELECTRONICS CORP0 citations42