Inventor
HWANG HYUNSU
KR15 patents
⚠️ This page may combine multiple inventors who share the name “HWANG HYUNSU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
14 patentsUS12593702B2Mar 31, 2026
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12347760B2Jul 1, 2025
Interconnection structure and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12119306B2Oct 15, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US12027482B2Jul 2, 2024
Semiconductor chip having a through electrode and semiconductor package including the semiconductor chip
SAMSUNG ELECTRONICS CO LTD0 citations61
US11923309B2Mar 5, 2024
Semiconductor package including fine redistribution patterns
SAMSUNG ELECTRONICS CO LTD0 citations61
US11798872B2Oct 24, 2023
Interconnection structure and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US11682630B2Jun 20, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US12381151B2Aug 5, 2025
Semiconductor device and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US12224256B2Feb 11, 2025
Wafer structure and semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations60
US11854893B2Dec 26, 2023
Method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11664312B2May 30, 2023
Semiconductor device and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US12451474B2Oct 21, 2025
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12009288B2Jun 11, 2024
Interconnection structure and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12456627B2Oct 28, 2025
Dry etching apparatus and wafer etching system using the same
SAMSUNG ELECTRONICS CO LTD0 citations47