Inventor
PERNG TSU-HSIU
TW33 patents
⚠️ This page may combine multiple inventors who share the name “PERNG TSU-HSIU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
28 patentsUS10950731B1Mar 16, 2021
Inner spacers for gate-all-around semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD25 citations94
US10490458B2Nov 26, 2019
Methods of cutting metal gates and structures formed thereof
TAIWAN SEMICONDUCTOR MFG CO LTD18 citations94
US11545400B2Jan 3, 2023
Methods of cutting metal gates and structures formed thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations86
US11152267B2Oct 19, 2021
Methods of cutting metal gates and structures formed thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10861752B2Dec 8, 2020
Methods of cutting metal gates and structures formed thereof
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US10510580B2Dec 17, 2019
Dummy fin structures and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US9601598B2Mar 21, 2017
Method of manufacturing a fin-like field effect transistor (FinFET) device
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US11855214B2Dec 26, 2023
Inner spacers for gate-all-around semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11664268B2May 30, 2023
Dummy fin structures and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11069558B2Jul 20, 2021
Dummy fin structures and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10115624B2Oct 30, 2018
Method of semiconductor integrated circuit fabrication
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9780216B2Oct 3, 2017
Combination FinFET and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11508843B1Nov 22, 2022
Semiconductor device having fully oxidized gate oxide layer and method for making the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11923251B2Mar 5, 2024
Methods of cutting metal gates and structures formed thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12336214B2Jun 17, 2025
Inner spacers for gate-all-around semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12154822B2Nov 26, 2024
Dummy fin structures and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12094952B2Sep 17, 2024
Air spacer formation with a spin-on dielectric material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11990545B2May 21, 2024
Semiconductor device having fully oxidized gate oxide layer and method for making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11626482B2Apr 11, 2023
Air spacer formation with a spin-on dielectric material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11222826B2Jan 11, 2022
FinFET structure and device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12317584B2May 27, 2025
Method of forming high voltage transistor and structure resulting therefrom
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12308312B2May 20, 2025
Interconnect structure and method for manufacturing the interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11637062B2Apr 25, 2023
Interconnect structure and method for manufacturing the interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11257753B2Feb 22, 2022
Interconnect structure and method for manufacturing the interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10685867B2Jun 16, 2020
Method of semiconductor integrated circuit fabrication
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10483169B2Nov 19, 2019
FinFET cut-last process using oxide trench fill
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9887274B2Feb 6, 2018
FinFETs and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9461041B2Oct 4, 2016
Metal gate finFET device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
TAIWAN SEMICONDUCTOR MFG
3 patentsUS8987791B2Mar 24, 2015
FinFETs and methods for forming the same
TAIWAN SEMICONDUCTOR MFG18 citations92
US9349841B2May 24, 2016
FinFETs and methods for forming the same
TAIWAN SEMICONDUCTOR MFG0 citations52
US9130059B2Sep 8, 2015
Method of fabricating a semiconductor device having a capping layer
TAIWAN SEMICONDUCTOR MFG1 citations52